30 lines
1.9 KiB
Plaintext
30 lines
1.9 KiB
Plaintext
(footprint "FIDUCIAL_1MM" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(fp_text reference "REF**" (at 0 0) (layer "F.SilkS")
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(effects (font (size 1.27 1.27) (thickness 0.15)))
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(tstamp 4b8d3dc3-06eb-4b5d-bf11-dbdf8c834c57)
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)
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(fp_text value "" (at 0 0) (layer "F.Fab")
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(effects (font (size 1.27 1.27) (thickness 0.15)))
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(tstamp 8d670238-72be-4e8b-b790-dab8545a8462)
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)
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(fp_arc (start -0.75 0) (mid -0.53033 -0.53033) (end 0 -0.75)
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(stroke (width 0.5) (type solid)) (layer "F.Mask") (tstamp b669e9b7-937a-46ca-8597-9aa5d2b2bfbd))
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(fp_arc (start 0 -0.75) (mid 0.53033 -0.53033) (end 0.75 0)
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(stroke (width 0.5) (type solid)) (layer "F.Mask") (tstamp 2cc91f88-cc85-44e5-a402-a1f6741a99d4))
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(fp_arc (start 0 0.75) (mid -0.53033 0.53033) (end -0.75 0)
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(stroke (width 0.5) (type solid)) (layer "F.Mask") (tstamp 961349e1-0cb0-4096-aa52-6e1c0d1a58f3))
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(fp_arc (start 0.75 0) (mid 0.53033 0.53033) (end 0 0.75)
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(stroke (width 0.5) (type solid)) (layer "F.Mask") (tstamp 02b564c4-0b43-4446-9f7a-a058f589ce5f))
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(fp_arc (start -0.75 0) (mid -0.53033 -0.53033) (end 0 -0.75)
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(stroke (width 0.5) (type solid)) (layer "F.CrtYd") (tstamp 9ee1ca05-1b69-4385-bc0e-2ceb3234a616))
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(fp_arc (start 0 -0.75) (mid 0.53033 -0.53033) (end 0.75 0)
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(stroke (width 0.5) (type solid)) (layer "F.CrtYd") (tstamp 03e25277-23d4-44c0-8596-dbc1e19b97ce))
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(fp_arc (start 0 0.75) (mid -0.53033 0.53033) (end -0.75 0)
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(stroke (width 0.5) (type solid)) (layer "F.CrtYd") (tstamp 1b9e74a7-5930-453e-8dff-4db90f06d314))
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(fp_arc (start 0.75 0) (mid 0.53033 0.53033) (end 0 0.75)
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(stroke (width 0.5) (type solid)) (layer "F.CrtYd") (tstamp d74fcd70-21e2-4236-a48b-cad8d2c0d8c8))
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(pad "1" smd roundrect (at 0 0) (size 1 1) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.5)
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(solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 0f792265-0a15-409d-ac53-00b78607c0e1))
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)
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