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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6bc1ea25-259e-47f3-9b55-a9810c451693))
(pad "30" smd rect (at -0.75 -2.5) (size 0.25 0.8) (layers "F.Cu" "F.Paste")
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d80e0b03-dddc-409d-ad59-883d9aece374))
(pad "31" smd rect (at -1.25 -2.5) (size 0.25 0.8) (layers "F.Cu" "F.Paste")
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 005ae316-e912-4d8b-b0d1-981e496f5270))
(pad "32" smd rect (at -1.75 -2.5) (size 0.25 0.8) (layers "F.Cu" "F.Paste")
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 20414221-73d2-43b1-9c8f-2a10f66447f6))
(pad "33" smd roundrect (at 0 0) (size 3.5 3.5) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.05)
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 44f7c15b-b1db-4d2b-bc25-f4d0046656de))
)
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