34 lines
2.4 KiB
Plaintext
34 lines
2.4 KiB
Plaintext
(footprint "EG1390" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(fp_text reference "REF**" (at -4 2.1 90) (layer "F.SilkS")
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(effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
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(tstamp 3e9ae533-66b9-4b58-992c-ab933143ebd8)
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)
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(fp_text value "EG1390" (at 5 2.7 90) (layer "F.Fab")
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(effects (font (size 0.93472 0.93472) (thickness 0.08128)) (justify left bottom))
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(tstamp 6097aa61-e648-42c7-bcfa-706fdd7d0754)
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)
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(fp_line (start -3.6 -1.75) (end 3.6 -1.75)
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(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 854ed4a7-2c32-47b2-ade4-53796d4f0707))
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(fp_line (start -3.6 1.75) (end -3.6 -1.75)
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(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 31d076ed-21b8-48b3-80b9-25f62690105b))
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(fp_line (start 3.6 -1.75) (end 3.6 1.75)
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(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 3bca4580-1ce5-4fa9-b85a-ebd9d074da41))
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(fp_line (start 3.6 1.75) (end -3.6 1.75)
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(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 50613a9f-ad54-41c8-a470-8e46d7e7e10b))
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(pad "" np_thru_hole circle (at -1.5 0) (size 1 1) (drill 1) (layers "*.Cu" "*.Mask") (tstamp a8cdd13d-cfb9-41c7-af2b-869cd369ef11))
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(pad "" np_thru_hole circle (at 1.5 0) (size 1 1) (drill 1) (layers "*.Cu" "*.Mask") (tstamp b1575ecd-10ed-43b0-997c-c8bd5c4cb3e1))
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(pad "O1" smd rect (at -2.5 -2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cec17c70-4917-45ca-80b9-5916e38a7889))
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(pad "O2" smd rect (at -2.5 2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ae476dab-ee65-4f3b-a9ed-5d0f40a2089a))
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(pad "P1" smd rect (at 0 -2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7e22ab0e-b834-4ac8-9a1d-22e8e0429b7f))
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(pad "P2" smd rect (at 0 2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 30fffd71-f953-42ea-bb79-5222382db740))
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(pad "S1" smd rect (at 2.5 -2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 79ef2c18-0d13-406e-9edb-2fc579df32b5))
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(pad "S2" smd rect (at 2.5 2.8) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8ad08908-1487-4e30-87cb-872a20b63185))
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)
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