(module NANO (layer F.Cu) (tedit 0)
  (fp_text reference U$1 (at 0 0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top))
  )
  (fp_text value NANO (at 0 0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top))
  )
  (pad TX0 thru_hole oval (at 5.08 8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad RX1 thru_hole oval (at 5.08 6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad RST1 thru_hole oval (at 5.08 3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad GND1 thru_hole oval (at 5.08 1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D2 thru_hole oval (at 5.08 -1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D3 thru_hole oval (at 5.08 -3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D4 thru_hole oval (at 5.08 -6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D5 thru_hole oval (at 5.08 -8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D6 thru_hole oval (at 5.08 -11.43) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D7 thru_hole oval (at 5.08 -13.97) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D8 thru_hole oval (at 5.08 -16.51) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D9 thru_hole oval (at 5.08 -19.05) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad RAW thru_hole oval (at -10.16 8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad GND thru_hole oval (at -10.16 6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad RST thru_hole oval (at -10.16 3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A3 thru_hole oval (at -10.16 -11.43) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A2 thru_hole oval (at -10.16 -13.97) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A1 thru_hole oval (at -10.16 -16.51) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A0 thru_hole oval (at -10.16 -19.05) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D13 thru_hole oval (at -10.16 -26.67) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D12 thru_hole oval (at 5.08 -26.67) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D11 thru_hole oval (at 5.08 -24.13) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad D10 thru_hole oval (at 5.08 -21.59) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 3.3V thru_hole oval (at -10.16 -24.13 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad AREF thru_hole oval (at -10.16 -21.59 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad 5V thru_hole oval (at -10.16 1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP2 thru_hole circle (at -5.08 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP4 thru_hole circle (at -2.54 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP6 thru_hole circle (at 0 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A4 thru_hole oval (at -10.16 -8.89 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A5 thru_hole oval (at -10.16 -6.35 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A6 thru_hole oval (at -10.16 -3.81 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad A7 thru_hole oval (at -10.16 -1.27 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP1 thru_hole circle (at -5.08 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP3 thru_hole circle (at -2.54 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
  (pad ICSP5 thru_hole circle (at 0 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
    (solder_mask_margin 0.1016))
)