Files
M4-Shim/M4-Shim-2.pretty/PQFN64-1.kicad_mod

191 lines
17 KiB
Plaintext
Raw Blame History

This file contains ambiguous Unicode characters
This file contains Unicode characters that might be confused with other characters. If you think that this is intentional, you can safely ignore this warning. Use the Escape button to reveal them.
(footprint "PQFN64-1" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(descr "<b>Plastic Quad Flat Non-leaded package</b> 64 pins, 9 × 9 × 0.85 mm³, 0.5 mm pitch<p>\nSource: https://www.micronas.com .. mas35x9f_3ds.pdf")
(fp_text reference "REF**" (at -3.81 -5.08) (layer "F.SilkS")
(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
(tstamp 3659b050-a429-4fdf-ac2a-1a32aa12cd68)
)
(fp_text value "PQFN64-1" (at -3.81 6.35) (layer "F.Fab")
(effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
(tstamp 4aed0d27-5868-4c0a-8b87-047c6464ed17)
)
(fp_poly
(pts
(xy -1.905 -0.381)
(xy -0.381 -0.381)
(xy -0.381 -1.905)
(xy -1.905 -1.905)
)
(stroke (width 0) (type default)) (fill solid) (layer "F.Paste") (tstamp 8c715bb2-5f94-4a56-ab39-a06bedbab51a))
(fp_poly
(pts
(xy -1.905 1.905)
(xy -0.381 1.905)
(xy -0.381 0.381)
(xy -1.905 0.381)
)
(stroke (width 0) (type default)) (fill solid) (layer "F.Paste") (tstamp 4bfbbdad-a0d6-410b-a71c-7d579b764eec))
(fp_poly
(pts
(xy 0.381 -0.381)
(xy 1.905 -0.381)
(xy 1.905 -1.905)
(xy 0.381 -1.905)
)
(stroke (width 0) (type default)) (fill solid) (layer "F.Paste") (tstamp d54486c1-ca85-49dc-89b0-b0daa3c40be7))
(fp_poly
(pts
(xy 0.381 1.905)
(xy 1.905 1.905)
(xy 1.905 0.381)
(xy 0.381 0.381)
)
(stroke (width 0) (type default)) (fill solid) (layer "F.Paste") (tstamp 9df8fdb8-4ab1-4902-b07a-6b8377656463))
(fp_circle (center -4.9 -4.9) (end -4.583775 -4.9)
(stroke (width 0.127) (type solid)) (fill none) (layer "F.SilkS") (tstamp 250af683-551b-444f-b145-a2f7e3fa20b8))
(fp_line (start -4.4 -4.4) (end -4.4 4.4)
(stroke (width 0.2032) (type solid)) (layer "F.Fab") (tstamp 7450b966-1ea6-4140-b701-a6b61cadbe46))
(fp_line (start -4.4 4.4) (end 4.4 4.4)
(stroke (width 0.2032) (type solid)) (layer "F.Fab") (tstamp ff948023-26ff-4f45-8d2f-2ca266295a95))
(fp_line (start 4.4 -4.4) (end -4.4 -4.4)
(stroke (width 0.2032) (type solid)) (layer "F.Fab") (tstamp 11964b58-e2fa-47ce-a3a6-5403d52b9b3d))
(fp_line (start 4.4 4.4) (end 4.4 -4.4)
(stroke (width 0.2032) (type solid)) (layer "F.Fab") (tstamp d7f0dc34-c7e8-4567-a1a5-1869e4258ab9))
(fp_circle (center -3.75 -3.75) (end -3.625 -3.75)
(stroke (width 0.25) (type solid)) (fill solid) (layer "F.Fab") (tstamp fa37b480-9020-4b3f-9439-716ab78cf405))
(pad "1" smd roundrect (at -4.45 -3.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 678a068a-24a4-418c-8445-fe0e3c38c45a))
(pad "2" smd roundrect (at -4.45 -3.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 91a11abc-df69-4c55-98ea-ea782e66a972))
(pad "3" smd roundrect (at -4.45 -2.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b056ae13-5db0-41da-a943-8c739d60006a))
(pad "4" smd roundrect (at -4.45 -2.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7e68212e-8640-42cb-b97f-c0d81144e19f))
(pad "5" smd roundrect (at -4.45 -1.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 568da250-90fe-4e20-85cc-4e1db0bc839e))
(pad "6" smd roundrect (at -4.45 -1.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fe42cbef-f8d7-4f9d-9d58-054afb92c781))
(pad "7" smd roundrect (at -4.45 -0.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 00be9f86-6b98-4856-b467-87862aa94880))
(pad "8" smd roundrect (at -4.45 -0.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c86a92a6-1a36-492d-9c6e-b7ce9cd23f31))
(pad "9" smd roundrect (at -4.45 0.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 01e5bf3b-74d6-4806-b15f-1989297d986b))
(pad "10" smd roundrect (at -4.45 0.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 05152658-69ad-46b2-bfc8-b2d94a38133e))
(pad "11" smd roundrect (at -4.45 1.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp de0c4f8f-27c4-47ac-9c06-3ac5d3eadfaa))
(pad "12" smd roundrect (at -4.45 1.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a670dc68-9e74-4401-9f7d-4644dfffa999))
(pad "13" smd roundrect (at -4.45 2.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 04978604-4988-43d0-855f-c426afc79b73))
(pad "14" smd roundrect (at -4.45 2.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 39cb9ff3-b475-42b9-857c-321d4098047a))
(pad "15" smd roundrect (at -4.45 3.25) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e98f96ab-14ae-4921-bd39-fd0a687ee1d1))
(pad "16" smd roundrect (at -4.45 3.75) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp da4d4c5e-a7a3-4ff2-927d-23af48a47e85))
(pad "17" smd roundrect (at -3.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6b54cd20-2349-4f67-aec3-8d13f25733d0))
(pad "18" smd roundrect (at -3.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dcf4f2e5-6938-4662-8481-6dccc96e578e))
(pad "19" smd roundrect (at -2.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 019948de-5ad4-4162-859f-7c5c583ff8c2))
(pad "20" smd roundrect (at -2.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 88514bef-c072-437a-bc62-5629351712a0))
(pad "21" smd roundrect (at -1.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 44491d3b-c16b-4ebd-9d78-a7e1d9d2c3d5))
(pad "22" smd roundrect (at -1.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 240a7388-b4d5-40aa-b234-f530c0b6d819))
(pad "23" smd roundrect (at -0.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 05342c0c-751f-44ae-8cd3-dc339582c7c2))
(pad "24" smd roundrect (at -0.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0b11d8f1-b4ac-4bb7-b4bd-b8224a8946a1))
(pad "25" smd roundrect (at 0.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a3da43c8-0ef0-41f4-ac20-9ada9bee4c9d))
(pad "26" smd roundrect (at 0.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ed29408a-dedd-4728-9567-aabfa4730447))
(pad "27" smd roundrect (at 1.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a03e8b96-0d0f-42d6-a594-4348d787f7a3))
(pad "28" smd roundrect (at 1.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6ff8d3cd-aa72-406f-8b28-f182629d5a07))
(pad "29" smd roundrect (at 2.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b707eb47-a543-40ff-b1b0-a350d1361360))
(pad "30" smd roundrect (at 2.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 15c54623-bc0c-49ca-9464-b2210ff6292d))
(pad "31" smd roundrect (at 3.25 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 47496192-0ce0-458c-b967-e343094d4144))
(pad "32" smd roundrect (at 3.75 4.45 90) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bd9a0cb2-4957-4997-9ebd-d68a97868791))
(pad "33" smd roundrect (at 4.45 3.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 11cc22e8-0725-4bd5-be90-2f446835b6cd))
(pad "34" smd roundrect (at 4.45 3.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 827db414-a44c-4f11-a676-3035ab0b5dc9))
(pad "35" smd roundrect (at 4.45 2.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 053a742f-bd0c-479d-896a-bc5ae33ea22e))
(pad "36" smd roundrect (at 4.45 2.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 95c6cf57-8ca2-4347-9c86-be8bfacbcf9b))
(pad "37" smd roundrect (at 4.45 1.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 01966dfd-ca77-42af-89e8-ff6ae8af1101))
(pad "38" smd roundrect (at 4.45 1.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cef1d0cd-b52d-4745-ba67-b2c75538a5d9))
(pad "39" smd roundrect (at 4.45 0.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7f0f8b3f-95d1-4937-ba8a-67e561da53f2))
(pad "40" smd roundrect (at 4.45 0.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5983fbb-dbaa-4cec-a5af-985a653bf56e))
(pad "41" smd roundrect (at 4.45 -0.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 74a27c8f-fbfb-48da-a84a-addaa6599ba7))
(pad "42" smd roundrect (at 4.45 -0.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0ecf1475-bd05-4c4f-b6c5-96d6b09fb1f9))
(pad "43" smd roundrect (at 4.45 -1.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7c625386-cd9c-447f-86ee-3a3fb88147fc))
(pad "44" smd roundrect (at 4.45 -1.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2da65a54-53c2-481f-8532-d76234adf57a))
(pad "45" smd roundrect (at 4.45 -2.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 26838fea-3148-48e6-b062-daf015d847f2))
(pad "46" smd roundrect (at 4.45 -2.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 96764965-accf-4eba-864b-27342f140663))
(pad "47" smd roundrect (at 4.45 -3.25 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6fd6fc1e-7631-480a-80c6-bbedac0c53f9))
(pad "48" smd roundrect (at 4.45 -3.75 180) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e933e188-081a-43f4-af53-49234bb73c9b))
(pad "49" smd roundrect (at 3.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4d50e005-f66a-4ecd-93e4-6b55cf673e43))
(pad "50" smd roundrect (at 3.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f0d0080b-72db-4a9c-9435-f2e17c2f5a9e))
(pad "51" smd roundrect (at 2.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 41c78a81-a583-437f-a49f-4f245fe18912))
(pad "52" smd roundrect (at 2.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9207481e-69d6-432a-929e-d37c7868c471))
(pad "53" smd roundrect (at 1.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d59da2d1-4deb-44b7-92b0-023983a9cada))
(pad "54" smd roundrect (at 1.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fde5d0a2-259d-4fac-b6da-b422e11f0912))
(pad "55" smd roundrect (at 0.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 47f8a740-5e1a-4fcb-828a-d0423f05fd22))
(pad "56" smd roundrect (at 0.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e1bbe412-bf9a-4902-abef-2bdc9e96f414))
(pad "57" smd roundrect (at -0.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eb3da32f-d31a-4df0-9133-60c78f6765ae))
(pad "58" smd roundrect (at -0.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 58141986-32ae-494c-859b-a3ef5d274567))
(pad "59" smd roundrect (at -1.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 10e24fb5-33e7-4fbf-80ea-4dbd3ffcaa90))
(pad "60" smd roundrect (at -1.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 06f02f2b-8476-4a76-930f-2c351cf1729b))
(pad "61" smd roundrect (at -2.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 59447707-c783-4cc3-92dc-a734711b3dfa))
(pad "62" smd roundrect (at -2.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0da93dad-844e-454c-81df-887dac9679ea))
(pad "63" smd roundrect (at -3.25 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 852b74c4-101d-4664-adc4-e6497523b0f3))
(pad "64" smd roundrect (at -3.75 -4.45 270) (size 0.7 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bc2b8f65-f755-4321-bc82-a53649e400ff))
(pad "EXP" smd roundrect (at 0 0) (size 4.7 4.7) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.1)
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a1926ae8-5400-4804-94b9-0fe7881dca60))
)