(module USB-MICROB-TH (layer F.Cu) (tedit 0)
  (fp_text reference USB1 (at 0 0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.15)))
  )
  (fp_text value USBMICROB-PTH (at 0 0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.15)))
  )
  (fp_line (start -3.4 2.15) (end -3 2.15) (layer F.Fab) (width 0.127))
  (fp_line (start 3 2.15) (end 3.4 2.15) (layer F.Fab) (width 0.127))
  (fp_line (start -3.4 2.15) (end -3.4 1.45) (layer F.Fab) (width 0.127))
  (fp_line (start -3.4 1.45) (end -3.4 -1.58) (layer F.Fab) (width 0.127))
  (fp_line (start 3.4 -1.58) (end 3.4 1.45) (layer F.Fab) (width 0.127))
  (fp_line (start 3.4 1.45) (end 3.4 2.15) (layer F.Fab) (width 0.127))
  (fp_line (start -3.4 1.45) (end 3.4 1.45) (layer F.Fab) (width 0.127))
  (fp_line (start -3.4 -1.25) (end -3.4 -1.58) (layer F.SilkS) (width 0.2032))
  (fp_line (start 3.4 -1.25) (end 3.4 -1.58) (layer F.SilkS) (width 0.2032))
  (fp_line (start -3.4 1.45) (end 3.4 1.45) (layer F.SilkS) (width 0.2032))
  (fp_line (start -3.4 -1.58) (end 3.4 -1.58) (layer F.Fab) (width 0.127))
  (fp_line (start -3.4 -1.58) (end 3.4 -1.58) (layer F.SilkS) (width 0.2032))
  (fp_line (start -3.4 2.15) (end -4 2.75) (layer F.Fab) (width 0.2032))
  (fp_line (start 3.4 2.15) (end 4 2.75) (layer F.Fab) (width 0.2032))
  (fp_line (start -3 2.15) (end -3 2.55) (layer F.Fab) (width 0.127))
  (fp_line (start -2.8 2.8) (end 2.75 2.8) (layer F.Fab) (width 0.127))
  (fp_line (start 3 2.6) (end 3 2.15) (layer F.Fab) (width 0.127))
  (fp_arc (start -2.762499 2.564999) (end -3 2.55) (angle -84.547378) (layer F.Fab) (width 0.127))
  (fp_arc (start 2.764999 2.562499) (end 2.75 2.8) (angle -84.547378) (layer F.Fab) (width 0.127))
  (pad VBUS smd rect (at -1.3 -2.65 90) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad GND smd rect (at 1.3 -2.65 90) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad D- smd rect (at -0.65 -2.65 90) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad D+ smd rect (at 0 -2.65 90) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad ID smd rect (at 0.65 -2.65 90) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad M5 smd rect (at -1.15 0 90) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad M6 smd rect (at 1.15 0 90) (size 1.8 1.8) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0508))
  (pad MT1 thru_hole circle (at -2.425 -2.8) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask)
    (solder_mask_margin 0.0508))
  (pad MT2 thru_hole circle (at 2.425 -2.8) (size 1.2 1.2) (drill 0.6) (layers *.Cu *.Mask)
    (solder_mask_margin 0.0508))
  (pad MT3 thru_hole circle (at -3.61 0 180) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
    (solder_mask_margin 0.0508))
  (pad MT4 thru_hole circle (at 3.61 0 90) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
    (solder_mask_margin 0.0508))
)
