From 83523ff6cbb0955fa3fdf5c13bd722346506ed07 Mon Sep 17 00:00:00 2001
From: Shamil Yakupov <shamil.yakupov@noviga.com>
Date: Fri, 19 May 2017 14:17:11 +0300
Subject: [PATCH] Add new elements

---
 jst/b06b-pask-1.yaml |  7 ++++++
 jst/b06b-pask.yaml   | 23 +++++++++++++++++++
 ti/am26lv31e.yaml    | 54 ++++++++++++++++++++++++++++++++++++++++++++
 ti/am26lv32e.yaml    | 54 ++++++++++++++++++++++++++++++++++++++++++++
 ti/tps2412.yaml      | 43 +++++++++++++++++++++++++++++++++++
 5 files changed, 181 insertions(+)
 create mode 100644 jst/b06b-pask-1.yaml
 create mode 100644 jst/b06b-pask.yaml
 create mode 100644 ti/am26lv31e.yaml
 create mode 100644 ti/am26lv32e.yaml
 create mode 100644 ti/tps2412.yaml

diff --git a/jst/b06b-pask-1.yaml b/jst/b06b-pask-1.yaml
new file mode 100644
index 0000000..54803a6
--- /dev/null
+++ b/jst/b06b-pask-1.yaml
@@ -0,0 +1,7 @@
+base: B06B-PASK
+name: B06B-PASK-1
+
+housing:
+  holeDiameter1: 1.2
+  padDiameter1: 0
+  padPosition1: -6.5, 2.15
diff --git a/jst/b06b-pask.yaml b/jst/b06b-pask.yaml
new file mode 100644
index 0000000..5702247
--- /dev/null
+++ b/jst/b06b-pask.yaml
@@ -0,0 +1,23 @@
+name: B06B-PASK
+description: PA 6-pin 2.0mm Pitch Wire-to-board (Crimp style/IDC) / Wire-to-wire (Crimp style/IDC) Connector
+datasheet: http://www.jst-mfg.com/product/pdf/eng/ePA-F.pdf
+keywords: Connector, Male
+
+pinout: 1-6
+
+schematic:
+  symbol: connector
+  options: single, square-pin
+
+housing:
+  pattern: custom
+  options: polarized
+  bodyWidth: 14
+  bodyLength: 5.3
+  height: 7.7
+
+  holeDiameter: 0.8
+  pitch: 2
+  rowCount: 1
+  columnCount: 6
+  rowDY: 0.45
diff --git a/ti/am26lv31e.yaml b/ti/am26lv31e.yaml
new file mode 100644
index 0000000..88f6a01
--- /dev/null
+++ b/ti/am26lv31e.yaml
@@ -0,0 +1,54 @@
+name: AM26LV31E
+description: Low-Voltage High-Speed Quadruple Differential Line Driver With +/-15-kV IEC ESD Protection
+datasheet: http://www.ti.com/lit/ds/symlink/am26lv31e.pdf
+keywords: IC, Digital, Transciever, Differential
+
+pinout:
+  G: 4
+  ~G: 12
+
+  1A: 1
+  2A: 7
+  3A: 9
+  4A: 15
+
+  OUT1:
+    1Y: 2
+    1Z: 3
+
+  OUT2:
+    2Y: 6
+    2Z: 5
+
+  OUT3:
+    3Y: 10
+    3Z: 11
+
+  OUT4:
+    4Y: 14
+    4Z: 13
+
+  GND: 8
+  VCC: 16
+
+properties:
+  in: 1A, 2A, 3A, 4A
+  out: OUT1-4
+  power: VCC
+  ground: GND
+  inverted: ~G, 1Z, 2Z, 3Z, 4Z
+
+schematic:
+  symbol: IC
+  left: G, ~G, 1A, 2A, 3A, 4A
+  right: OUT1-4
+  top: VCC
+  bottom: GND
+
+housing:
+  outline: JEDEC MO-153 AB
+  suffix: IPW
+
+  padWidth: 1.6
+  padHeight: 0.35
+  padDistance: 5.6
diff --git a/ti/am26lv32e.yaml b/ti/am26lv32e.yaml
new file mode 100644
index 0000000..9b21533
--- /dev/null
+++ b/ti/am26lv32e.yaml
@@ -0,0 +1,54 @@
+name: AM26LV32E
+description: Low-Voltage High-Speed Quadruple Differential Line Receiver With +/-15-kV IEC ESD Protection
+datasheet: http://www.ti.com/lit/ds/symlink/am26lv32e.pdf
+keywords: IC, Digital, Transciever, Differential
+
+pinout:
+  G: 4
+  ~G: 12
+
+  1Y: 3
+  2Y: 5
+  3Y: 11
+  4Y: 13
+
+  IN1:
+    1A: 2
+    1B: 1
+
+  IN2:
+    2A: 6
+    2B: 7
+
+  IN3:
+    3A: 10
+    3B: 9
+
+  IN4:
+    4A: 14
+    4B: 15
+
+  GND: 8
+  VCC: 16
+
+properties:
+  in: IN1-4
+  out: 1Y, 2Y, 3Y, 4Y
+  power: VCC
+  ground: GND
+  inverted: ~G, 1B, 2B, 3B, 4B
+
+schematic:
+  symbol: IC
+  left: G, ~G, IN1-4
+  right: 1Y, 2Y, 3Y, 4Y
+  top: VCC
+  bottom: GND
+
+housing:
+  outline: JEDEC MO-153 AB
+  suffix: IPW
+
+  padWidth: 1.6
+  padHeight: 0.35
+  padDistance: 5.6
diff --git a/ti/tps2412.yaml b/ti/tps2412.yaml
new file mode 100644
index 0000000..b842d3f
--- /dev/null
+++ b/ti/tps2412.yaml
@@ -0,0 +1,43 @@
+name: TPS2412
+variations: TSSOP, SOIC
+description: N+1 and OR-ing Power Rail Controller
+datasheet: http://www.ti.com/lit/ds/symlink/tps2412.pdf
+keywords: IC, Analog, Driver
+
+pinout:
+  VDD: 1
+  RSET: 2
+  RSVD: 3
+  GND: 4
+  GATE: 5
+  C: 6
+  A: 7
+  BYP: 8
+
+properties:
+  in: RSET, A, C
+  out: GATE
+  power: VDD
+  ground: GND, RSVD
+
+schematic:
+  symbol: IC
+  left: RSET
+  right: VDD, C, GATE, BYP, A
+  bottom: GND, RSVD
+
+housing@TSSOP:
+  suffix: PW
+  outline: JEDEC MO-153 AA
+
+  padWidth: 1.5
+  padHeight: 0.45
+  padDistance: 5.8
+
+housing@SOIC:
+  suffix: D
+  outline: JEDEC MS-012 AA
+
+  padWidth: 1.55
+  padHeight: 0.6
+  padDistance: 5.4