22 lines
1.4 KiB
Plaintext
22 lines
1.4 KiB
Plaintext
(footprint "BZA900A" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(fp_text reference "REF**" (at -0.5 -1.8) (layer "F.SilkS")
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(effects (font (size 0.373888 0.373888) (thickness 0.032512)) (justify left bottom))
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(tstamp 25d43efd-bdc3-4433-9387-1428e71fbfc4)
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)
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(fp_text value "" (at 0 0) (layer "F.Fab")
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(effects (font (size 1.27 1.27) (thickness 0.15)))
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(tstamp d78021d2-fb38-4a4a-8cd0-b99a4ce9021d)
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)
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(pad "P$1" smd rect (at -0.05 0) (size 0.325 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0542dd62-c4d4-4a02-8dde-f2fd811277b2))
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(pad "P$2" smd rect (at 0.5 0) (size 0.3 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a90536b7-3586-41a8-8dbf-00f5485ff5bd))
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(pad "P$3" smd rect (at 1.05 0) (size 0.325 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4b38bf39-caa4-41ff-953d-603496d69f9b))
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(pad "P$4" smd rect (at 1 -1.7) (size 0.4 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 81a69c09-d614-41ae-808e-70bc8fe8c3c5))
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(pad "P$5" smd rect (at 0 -1.7) (size 0.4 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a38be786-ef0d-46b3-aaf7-331c427c5338))
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)
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