66 lines
4.0 KiB
Plaintext
66 lines
4.0 KiB
Plaintext
(module primarypoints:Semtech_QFN-16-1EP_3x3mm_Pitch0.5mm_ThermalVias_RearPad (layer F.Cu) (tedit 5B05C773)
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(descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "QFN 0.5")
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(attr smd)
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(fp_text reference REF** (at 0 -2.45) (layer F.SilkS)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_text value Semtech_QFN-16-1EP_3x3mm_Pitch0.5mm_ThermalVias_RearPad (at 0 2.5) (layer F.SilkS)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_line (start -2.1 -2.1) (end -2.1 2.1) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.1 -2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.1 -2.1) (end 2.1 -2.1) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.1 2.1) (end 2.1 2.1) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.625 -1.625) (end 1.625 -1.125) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.625 1.625) (end -1.625 1.125) (layer F.SilkS) (width 0.15))
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(fp_line (start 1.625 1.625) (end 1.625 1.125) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.625 -1.625) (end -1.125 -1.625) (layer F.SilkS) (width 0.15))
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(fp_line (start -1.625 1.625) (end -1.125 1.625) (layer F.SilkS) (width 0.15))
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(fp_line (start 1.625 1.625) (end 1.125 1.625) (layer F.SilkS) (width 0.15))
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(fp_line (start 1.625 -1.625) (end 1.125 -1.625) (layer F.SilkS) (width 0.15))
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(pad 5 smd rect (at -0.75 1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 17 thru_hole circle (at 0 0.65) (size 0.508 0.508) (drill 0.254) (layers *.Cu B.Mask)
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(zone_connect 2))
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(pad 17 thru_hole circle (at 0.65 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu B.Mask)
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(zone_connect 2))
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(pad 17 thru_hole circle (at -0.65 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu B.Mask)
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(zone_connect 2))
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(pad 17 thru_hole circle (at 0 0) (size 0.508 0.508) (drill 0.254) (layers *.Cu *.Mask)
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(solder_mask_margin -0.127) (zone_connect 2))
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(pad 17 smd rect (at 0 0) (size 1.7 1.7) (layers B.Cu B.Mask)
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(zone_connect 2))
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(pad 1 smd rect (at -1.5 -0.75) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 0.425 0.425) (size 0.85 0.85) (layers F.Paste)
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(solder_paste_margin -0.1) (zone_connect 0))
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(pad 17 smd rect (at 0.425 -0.425) (size 0.85 0.85) (layers F.Paste)
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(solder_paste_margin -0.1) (zone_connect 0))
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(pad 17 smd rect (at -0.425 0.425) (size 0.85 0.85) (layers F.Paste)
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(solder_paste_margin -0.1) (zone_connect 0))
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(pad 17 smd rect (at -0.425 -0.425) (size 0.85 0.85) (layers F.Paste)
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(solder_paste_margin -0.1) (zone_connect 0))
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(pad 17 thru_hole circle (at 0 -0.65) (size 0.508 0.508) (drill 0.254) (layers *.Cu B.Mask)
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(zone_connect 2))
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(pad 2 smd rect (at -1.5 -0.25) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -1.5 0.25) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -1.5 0.75) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -0.25 1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at 0.25 1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at 0.75 1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at 1.5 0.75) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at 1.5 0.25) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 1.5 -0.25) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 1.5 -0.75) (size 0.65 0.35) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 0.75 -1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 0.25 -1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at -0.25 -1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at -0.75 -1.5) (size 0.35 0.65) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 0 0) (size 1.7 1.7) (layers F.Cu F.Mask)
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(zone_connect 2))
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(model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_Pitch0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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