(footprint "Texas_DSBGA-12_1.24x1.64mm_Layout3x4_P0.4mm" (version 20210108) (generator pcbnew) (layer "F.Cu")
  (tedit 60023789)
  (descr "Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
  (tags "Texas Instruments DSBGA BGA")
  (solder_mask_margin 0.0375)
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    (tstamp 5fa17142-52e0-410c-af13-b4cd5c979b49)
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  (pad "A2" smd circle (at -0.2 -0.4 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 06c866a2-5e36-459d-81f7-0106b36b9a3d))
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  (pad "B3" smd circle (at 0.2 0 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 4c5d167a-4b7b-4bff-ae06-50a30b0f00b1))
  (pad "B4" smd circle (at 0.6 0 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 2bece3c9-010b-44b3-bd2f-e60f79e26606))
  (pad "C1" smd circle (at -0.6 0.4 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 1d22bb9b-d437-4048-863e-74b4c6041501))
  (pad "C2" smd circle (at -0.2 0.4 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 886ce362-24bf-431b-8333-2b42c3fde051))
  (pad "C3" smd circle (at 0.2 0.4 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 9ceab821-3f17-4c03-a626-1514639b9314))
  (pad "C4" smd circle (at 0.6 0.4 270) (locked) (size 0.225 0.225) (property pad_prop_bga) (layers "F.Cu" "F.Mask") (tstamp 4adc2e1e-dc56-46d9-9bf9-317579030b07))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
