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Fix silkscreen overlap in footprints
Signed-off-by: Stefan Agner <stefan@agner.ch>
This commit is contained in:
Stefan Agner
@@ -1,59 +1,59 @@
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(footprint "SiliconLabs_MGM210P" (version 20210108) (generator pcbnew) (layer "F.Cu")
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(tedit 60156239)
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(tedit 6022E6CC)
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(fp_text reference "REF**" (at 0 9 unlocked) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp fe91c09a-a682-4f7d-8221-56d9673a0cfb)
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(tstamp a010f78f-2231-46e2-9c7c-a41c0ad9c727)
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)
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(fp_text value "SiliconLabs_MGM210P" (at 0 10.5 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 881f8c6c-479b-4a79-a278-ba22766d3dfa)
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(tstamp 1a1c949f-f801-48bc-80a0-a86736a4828c)
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)
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(fp_text user "${REFERENCE}" (at 0 12 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 76fa17c0-96c0-4530-85fc-282412f28e1f)
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(tstamp 00ab9f5f-5df1-472b-ad55-ad4c8654b38a)
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)
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(fp_line (start -6.6 7.65) (end -6.6 6.15) (layer "F.SilkS") (width 0.12) (tstamp 28debed8-9e8d-4ccf-ab8f-88fc0d0d9329))
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(fp_line (start -6.6 7.65) (end -5.1 7.65) (layer "F.SilkS") (width 0.12) (tstamp 2d7298ae-1f29-401f-8c8c-8c6401f7f7da))
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(fp_line (start -6.6 -7.5) (end -6.6 -6) (layer "F.SilkS") (width 0.12) (tstamp 3e8903cc-f290-41a8-b91a-092cfc6aa8a1))
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(fp_line (start 6.6 7.65) (end 5.1 7.65) (layer "F.SilkS") (width 0.12) (tstamp 42b9075c-cc92-4e2c-9ce2-68a7b4fc3479))
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(fp_line (start 6.6 7.65) (end 6.6 6.15) (layer "F.SilkS") (width 0.12) (tstamp 7233a03b-d08c-475d-96d9-f840a364249e))
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(fp_line (start 6.6 -7.5) (end 6.6 -6) (layer "F.SilkS") (width 0.12) (tstamp ac8dd815-cfa2-42f1-9395-e36870c5fd36))
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(fp_line (start 6.45 -7.5) (end -6.45 -7.5) (layer "F.Fab") (width 0.1) (tstamp 373a746c-57ad-4a33-9a4b-622c57867506))
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||||
(fp_line (start 6.45 7.5) (end 6.45 -7.5) (layer "F.Fab") (width 0.1) (tstamp 58d6a08f-a13e-4213-9f76-762b272ffd89))
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(fp_line (start -6.45 7.5) (end 6.45 7.5) (layer "F.Fab") (width 0.1) (tstamp 81bfc477-b596-48bf-99d4-9c42177f5796))
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(fp_line (start -6.45 -7.5) (end -6.45 7.5) (layer "F.Fab") (width 0.1) (tstamp 87b9413a-bab4-43e4-a839-e27a0b12642d))
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(pad "1" smd oval (at -5.65 -6.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2e929d65-3d2a-4945-947d-846d8325e4fd))
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(pad "2" smd oval (at -5.65 -5.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2a35c915-394a-405b-ad30-5ed02dce5041))
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(pad "3" smd oval (at -5.65 -4.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a1d8f701-d0e2-412c-83dc-2472c7db79f7))
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(pad "4" smd oval (at -5.65 -3.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 91f1e38c-aca4-4390-a14f-e0ffc3c333d2))
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||||
(pad "5" smd oval (at -5.65 -1.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d96baa4a-c973-4518-abe2-d272a0c85703))
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(pad "6" smd oval (at -5.65 -0.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8b9168e0-44a7-4cdd-be3d-75a0a2c9a1ba))
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(pad "7" smd oval (at -5.65 0.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4b3b8fee-2f7a-4da1-b646-a498187f34e0))
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(pad "8" smd oval (at -5.65 1.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1177e853-0021-404f-a568-9099b2ea9e00))
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||||
(pad "9" smd oval (at -5.65 2.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5d6b6b5a-4a0a-475c-8f02-857ec10e5ead))
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||||
(pad "10" smd oval (at -5.65 4.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp affb608d-f3a9-48c7-a569-49e2110df2a0))
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||||
(pad "11" smd oval (at -5.65 5.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 319fb623-0fdb-41a6-85fb-ff92e2ef3a72))
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||||
(pad "12" smd oval (at -5.65 6.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2262c7c-3938-42d3-981e-177f8775235b))
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||||
(pad "13" smd oval (at -3.6 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 411506c9-9382-4ad0-a9b3-fb2fb5150e60))
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||||
(pad "14" smd oval (at -2.4 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4fe54c58-5d20-4b2d-a80a-da06688388ed))
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||||
(pad "15" smd oval (at -1.2 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fb305b5e-2d8c-4880-859a-008391c52a1c))
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||||
(pad "16" smd oval (at 0 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7e743296-783f-41dc-8962-b79c7c88b9b6))
|
||||
(pad "17" smd oval (at 1.2 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 212fb629-9cfa-4b3a-a9f8-1d5cc9e24d1e))
|
||||
(pad "18" smd oval (at 2.4 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8d93e325-79aa-4f19-bbdd-9d4c5694b114))
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||||
(pad "19" smd oval (at 3.6 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5d7611a8-20c2-4681-b723-3e27fda243f3))
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||||
(pad "20" smd oval (at 5.65 6.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 82da7755-f150-4ffd-8d40-f4e95b5e3c9e))
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||||
(pad "21" smd oval (at 5.65 5.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 12aad41c-f015-4893-8f0f-ef022448bc0d))
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||||
(pad "22" smd oval (at 5.65 4.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 73e785ec-5f74-42d9-b960-850bd6b82aab))
|
||||
(pad "23" smd oval (at 5.65 2.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 54115ab1-c4a0-4594-b513-ae139e29a347))
|
||||
(pad "24" smd oval (at 5.65 1.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8251cba9-35fd-4912-aac4-e1540448de2c))
|
||||
(pad "25" smd oval (at 5.65 0.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1608d9d4-c68f-4bd0-aa0f-d2142b87ec9c))
|
||||
(pad "26" smd oval (at 5.65 -0.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ef87d95e-fa63-4b69-8a27-6ed3ff79dbfe))
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||||
(pad "27" smd oval (at 5.65 -1.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e4ea3e12-3906-4971-bda4-6d58712d237c))
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||||
(pad "28" smd oval (at 5.65 -3.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cfe7b79-d0c2-444a-ad90-98f16dd7be2a))
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||||
(pad "29" smd oval (at 5.65 -4.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b1863e0d-4da4-4e2c-835f-b5bd994fbabc))
|
||||
(pad "30" smd oval (at 5.65 -5.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5822b650-ebe6-433b-b398-c97b89956753))
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||||
(pad "31" smd oval (at 5.65 -6.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5be7b9ed-cb26-4383-92ce-3deef7262e05))
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(zone (net 0) (net_name "") (layers *.Cu) (tstamp b67d2bf5-8f04-4807-a701-a64f3e2d160d) (name "copper clearance") (hatch edge 0.508)
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(fp_line (start 6.6 7.65) (end 6.6 7.05) (layer "F.SilkS") (width 0.12) (tstamp 098d16a0-90b8-4631-8b5e-e922de3ba6d4))
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||||
(fp_line (start 6.6 -7.5) (end 6.6 -7.2) (layer "F.SilkS") (width 0.12) (tstamp 51515b3a-cbb8-4a27-83ab-3bc2235842cf))
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||||
(fp_line (start -6.6 7.65) (end -5.1 7.65) (layer "F.SilkS") (width 0.12) (tstamp c64469ee-b8a8-4455-a5f1-4a7786a4d54c))
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||||
(fp_line (start -6.6 -7.5) (end -6.6 -7.2) (layer "F.SilkS") (width 0.12) (tstamp c779dcf8-de86-44dc-8523-7770484b663a))
|
||||
(fp_line (start 6.6 7.65) (end 5.1 7.65) (layer "F.SilkS") (width 0.12) (tstamp cb1e251d-43a1-4b80-8371-c1b2695868d0))
|
||||
(fp_line (start -6.6 7.65) (end -6.6 7.05) (layer "F.SilkS") (width 0.12) (tstamp d5b078f2-2fb2-4aea-811d-9448fa6e3c95))
|
||||
(fp_line (start -6.45 7.5) (end 6.45 7.5) (layer "F.Fab") (width 0.1) (tstamp 0471b787-90b4-4a30-a3b2-842a1d4c252e))
|
||||
(fp_line (start 6.45 7.5) (end 6.45 -7.5) (layer "F.Fab") (width 0.1) (tstamp 3edc9504-ca93-4370-85f5-abf4194de2dc))
|
||||
(fp_line (start 6.45 -7.5) (end -6.45 -7.5) (layer "F.Fab") (width 0.1) (tstamp 5f45f93c-deb3-4c87-bcc4-943f1e680016))
|
||||
(fp_line (start -6.45 -7.5) (end -6.45 7.5) (layer "F.Fab") (width 0.1) (tstamp eaebf137-3127-4a2e-90ce-b54af3c7c0e4))
|
||||
(pad "1" smd oval (at -5.65 -6.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 23afdfb0-5ae9-44ee-8fdf-9012f9363f56))
|
||||
(pad "2" smd oval (at -5.65 -5.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dfbbceaf-09f6-4c72-88e6-8e90ccfd1026))
|
||||
(pad "3" smd oval (at -5.65 -4.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 481b3a65-9627-4b25-a085-a66594cdfd06))
|
||||
(pad "4" smd oval (at -5.65 -3.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 99a5f650-20b4-45ff-b76e-15c293ecceff))
|
||||
(pad "5" smd oval (at -5.65 -1.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 423c885a-c820-4aa5-aeb0-71e95ac61775))
|
||||
(pad "6" smd oval (at -5.65 -0.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 434b98d3-9e67-467a-8643-3791ed5a379d))
|
||||
(pad "7" smd oval (at -5.65 0.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 39568d5e-972b-4948-a735-56a23b066877))
|
||||
(pad "8" smd oval (at -5.65 1.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 9d8c42af-f501-4197-ac32-aa3180cba0ea))
|
||||
(pad "9" smd oval (at -5.65 2.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 068b0055-2c5e-4111-8108-49046e32c728))
|
||||
(pad "10" smd oval (at -5.65 4.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 05ec3f2a-f9a4-48a9-a75d-dcff3fbd4ba6))
|
||||
(pad "11" smd oval (at -5.65 5.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4c324322-7f0b-41d4-9a13-b1faa8ede4a3))
|
||||
(pad "12" smd oval (at -5.65 6.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0361919d-eeb8-4089-89a2-f538b36ff0df))
|
||||
(pad "13" smd oval (at -3.6 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0a2ac595-650b-4ec4-885f-5b1168be72a5))
|
||||
(pad "14" smd oval (at -2.4 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 84d7787e-52ca-4453-abdc-cbcef74d29ba))
|
||||
(pad "15" smd oval (at -1.2 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b63ab77a-3aeb-468f-8c32-0a88a0622d2c))
|
||||
(pad "16" smd oval (at 0 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 341badff-f9f6-44a3-945c-2817ca4f84e2))
|
||||
(pad "17" smd oval (at 1.2 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0e660ca5-8f39-4b6e-941c-654e1a2c0c33))
|
||||
(pad "18" smd oval (at 2.4 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 405ff914-e7e3-4de8-a83e-5268c8b833e8))
|
||||
(pad "19" smd oval (at 3.6 6.7 270) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 98299a46-8f0f-4191-874a-7f418b893325))
|
||||
(pad "20" smd oval (at 5.65 6.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 74016378-4e36-4801-800d-2985671de186))
|
||||
(pad "21" smd oval (at 5.65 5.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1233b381-1572-49d1-bc8c-71ef7557c0a8))
|
||||
(pad "22" smd oval (at 5.65 4.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3c3cf8e9-d3cf-4513-aa70-3120910171b1))
|
||||
(pad "23" smd oval (at 5.65 2.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp cbdcc011-4e6b-42a6-8df6-4e404a125538))
|
||||
(pad "24" smd oval (at 5.65 1.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f8fcf32c-0a34-444c-8d2e-4f4327dd1ca1))
|
||||
(pad "25" smd oval (at 5.65 0.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ad92f63e-3620-4520-9d87-b9a850237962))
|
||||
(pad "26" smd oval (at 5.65 -0.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6a8e3067-95ad-437c-972c-d57f377512c1))
|
||||
(pad "27" smd oval (at 5.65 -1.9) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 35b4a8e9-4489-481a-b078-67f927970c7d))
|
||||
(pad "28" smd oval (at 5.65 -3.1) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 92e67b07-e03b-4534-be39-d2a905a80fd0))
|
||||
(pad "29" smd oval (at 5.65 -4.3) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 88e9b4b6-333c-4787-a0b7-54eb2f1ebc18))
|
||||
(pad "30" smd oval (at 5.65 -5.5) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 48e8c27f-d8a4-4511-8e81-9b79f3b85e2e))
|
||||
(pad "31" smd oval (at 5.65 -6.7) (size 2.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 771202db-170b-4eeb-9e43-11f06d8ffb00))
|
||||
(zone (net 0) (net_name "") (layers *.Cu) (tstamp bb0362d5-ce04-4c2b-b08c-6ac102ae88a3) (name "copper clearance") (hatch edge 0.508)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.254)
|
||||
(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
|
||||
|
||||
@@ -1,167 +1,167 @@
|
||||
(footprint "Texas_VQFN-47-2EP_5x7mm_P0.4mm_ThermalVias" (version 20210108) (generator pcbnew) (layer "F.Cu")
|
||||
(tedit 600F0ADD)
|
||||
(tedit 6022E559)
|
||||
(descr "45-Lead Plastic Quad Flat, No Lead Package - 5x7x1mm Body (https://www.ti.com/lit/ds/symlink/tps23734.pdf)")
|
||||
(tags "VQFN 0.4")
|
||||
(attr smd)
|
||||
(fp_text reference "REF**" (at 0 -4.7) (layer "F.SilkS")
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
(tstamp 704db6f8-b8b3-46b6-bebc-ed96403aa4ed)
|
||||
(tstamp db3f15f2-21c6-4e9e-a638-1299dff4bb1e)
|
||||
)
|
||||
(fp_text value "Texas_VQFN-47-2EP_5x7mm_P0.4mm" (at 0 4.9) (layer "F.Fab")
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
(tstamp fc118c45-569f-4b94-b69f-552eb7b79ae4)
|
||||
(tstamp d6fec916-d952-47e1-b383-7490a9de71b8)
|
||||
)
|
||||
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
(tstamp 045a0b13-d015-408b-8b0c-4067c99096b7)
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(pad "24" smd roundrect (at 2.4 2.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 3a6f1fb2-2331-4666-81c2-ef55c3c6e3fd))
|
||||
(solder_mask_margin 0.05) (tstamp bee02625-8a08-4907-9d59-4afc8ead7e82))
|
||||
(pad "25" smd roundrect (at 2.4 1.8 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp b6993604-442e-4978-a1e3-3cc71c064c10))
|
||||
(solder_mask_margin 0.05) (tstamp 2af995dd-824a-4c12-b740-877c22e7b342))
|
||||
(pad "26" smd roundrect (at 2.4 1.4 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 17f01438-cf3f-4082-a454-114ce4e9d5c5))
|
||||
(solder_mask_margin 0.05) (tstamp 53986ca8-930a-4d4d-92c3-bf4cb4dda8fe))
|
||||
(pad "27" smd roundrect (at 2.4 1 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp e094b6c3-acdd-4f0d-8392-152412e9f06b))
|
||||
(solder_mask_margin 0.05) (tstamp af3e7859-8d76-4e75-ad50-cbea33fe2031))
|
||||
(pad "28" smd roundrect (at 2.4 0.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 553306bb-6ff9-46ec-ab14-766b603348d3))
|
||||
(solder_mask_margin 0.05) (tstamp b40e904f-6a94-49d3-8668-af3d99d629ea))
|
||||
(pad "29" smd roundrect (at 2.4 0.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 0293e2ae-8b9d-47ac-9940-c14d6332c426))
|
||||
(solder_mask_margin 0.05) (tstamp 0d6973d9-0f74-41db-9e92-bddc177a2f72))
|
||||
(pad "30" smd roundrect (at 2.4 -0.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp b9220d50-3e5f-4f7d-ba89-3495b0b71b83))
|
||||
(solder_mask_margin 0.05) (tstamp 759242ee-78f2-4549-a8f6-11dbd4e3ebe2))
|
||||
(pad "31" smd roundrect (at 2.4 -1 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 1f010495-555d-4dca-a01a-42a300c081c2))
|
||||
(solder_mask_margin 0.05) (tstamp c91ecca8-4b70-4725-8449-da090e73d4b5))
|
||||
(pad "32" smd roundrect (at 2.4 -1.4 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp d247c5aa-4557-4cb8-abc7-1fffd9211ec7))
|
||||
(solder_mask_margin 0.05) (tstamp fd169f9d-4c36-47a7-8a13-084723825057))
|
||||
(pad "33" smd roundrect (at 2.4 -1.8 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp d733ddd8-0863-4eb8-b3a7-740909f09b22))
|
||||
(solder_mask_margin 0.05) (tstamp 68543a4a-c64c-432c-a4b9-47a45f27f806))
|
||||
(pad "34" smd roundrect (at 2.4 -2.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 5150d949-db29-4b09-8e21-c5c13c633215))
|
||||
(solder_mask_margin 0.05) (tstamp ee6fc1f9-fc6f-43d0-b5e9-0874226bf693))
|
||||
(pad "35" smd roundrect (at 2.4 -2.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 9aa2358e-2a36-46a5-8567-2fc058c80200))
|
||||
(solder_mask_margin 0.05) (tstamp 4d1c8ad8-b4dc-4a35-bd99-a31e4b0440a9))
|
||||
(pad "36" smd roundrect (at 1.8 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp f6291fee-c58c-4e69-bfbc-3fb1d9fae235))
|
||||
(solder_mask_margin 0.05) (tstamp 67ed900b-00cb-4b6b-8f35-e8aa3b683601))
|
||||
(pad "37" smd roundrect (at 1.4 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 14621c36-4278-4ab8-a5c0-809837696bb9))
|
||||
(solder_mask_margin 0.05) (tstamp 2da475f8-cdfc-4156-b3b1-358db3f4ba9f))
|
||||
(pad "38" smd roundrect (at 1 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp afa140db-800b-4c96-a5b0-81aa50b3ca7e))
|
||||
(solder_mask_margin 0.05) (tstamp 618c8ff2-7f83-4b30-800c-144525690a45))
|
||||
(pad "39" smd roundrect (at 0.6 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp f462a232-3b34-47ad-a265-2b549a46a5f3))
|
||||
(solder_mask_margin 0.05) (tstamp c63cfd9f-d4c1-42a9-a88a-935ffecb7807))
|
||||
(pad "40" smd roundrect (at 0.2 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 292e2739-3c76-4eab-a209-2414f9f078dc))
|
||||
(solder_mask_margin 0.05) (tstamp bbdfb2d3-8e4e-416c-94da-d8e5abb97540))
|
||||
(pad "41" smd roundrect (at -0.2 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp b2b0853d-825c-499a-907d-9ec573257f43))
|
||||
(solder_mask_margin 0.05) (tstamp 5093be61-171e-4ac5-868c-f04a2c60206d))
|
||||
(pad "42" smd roundrect (at -0.6 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp 042b9ddf-cac0-4944-9cb0-abd6866c12b1))
|
||||
(solder_mask_margin 0.05) (tstamp fa45f016-353e-4f7d-b5d7-9a0e69bf1216))
|
||||
(pad "43" smd roundrect (at -1 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp a49d9328-405b-4056-950d-6e59607adb33))
|
||||
(solder_mask_margin 0.05) (tstamp 3df131c7-f913-4505-8e57-71dab04241ac))
|
||||
(pad "44" smd roundrect (at -1.4 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp f3fd9ae0-9a31-4308-93c7-a4371b6e0248))
|
||||
(solder_mask_margin 0.05) (tstamp abfd2beb-3bee-490e-90ba-ed68e75e05c8))
|
||||
(pad "45" smd roundrect (at -1.8 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
|
||||
(solder_mask_margin 0.05) (tstamp ea7c38de-7612-435b-a6f0-c3b61dba5b08))
|
||||
(pad "46" thru_hole circle (at -0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 002f2b78-5689-49e1-ab3d-df9f8559089e))
|
||||
(pad "46" thru_hole circle (at -1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 0c232fde-6453-4b35-b5a2-a369c2601337))
|
||||
(solder_mask_margin 0.05) (tstamp e03ad232-4b86-457c-8f44-086721e06e74))
|
||||
(pad "46" thru_hole circle (at -0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 0df109ad-318a-40ab-b222-c17cfffdfcd3))
|
||||
(pad "46" smd roundrect (at 0 -1.4) (locked) (size 3.7 2.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.023)
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 191086af-690f-40d1-95b4-a1dd2ef58ae0))
|
||||
(pad "46" thru_hole circle (at -0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 1e3fc0a3-445f-42a5-b587-b6b43d57748c))
|
||||
(pad "46" thru_hole circle (at 1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 4831f07c-38e7-415a-8cdb-059a4ffc4e65))
|
||||
(pad "46" thru_hole circle (at 0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 48648818-d3e5-41f3-8d98-6da7db871b82))
|
||||
(pad "46" thru_hole circle (at 0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 8b33f115-567a-4a40-a5ba-29156fd46c4d))
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 4c4302f5-d5e4-48ee-ad03-735cd6f25a4a))
|
||||
(pad "46" thru_hole circle (at 1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 5bf85ca7-e194-43e4-8908-1a486678d3c2))
|
||||
(pad "46" thru_hole circle (at 0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 67244f40-5845-4f65-917e-b134f7473062))
|
||||
(pad "46" thru_hole circle (at -0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 732d989d-308a-4f7a-9045-9a81a64900a0))
|
||||
(pad "46" thru_hole circle (at 0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 8e2225f1-fef2-46b4-ad98-2a78c393257f))
|
||||
(pad "46" thru_hole circle (at 0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b44be243-3ac0-4a9e-8a4f-c921c2cd8cf1))
|
||||
(pad "46" thru_hole circle (at -1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b86f8b76-f412-4884-80a9-517992597c85))
|
||||
(pad "46" smd roundrect (at 0 -1.4) (locked) (size 3.7 2.1) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023)
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 8f1c9700-c3c0-49c4-919d-523114fa9052))
|
||||
(pad "46" thru_hole circle (at -0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp cd2aa4d9-3097-4b2b-918e-ae1e8ee147c2))
|
||||
(pad "46" thru_hole circle (at 0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp f5d14783-f983-452e-a7fd-412f41d62c32))
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp ba9efbc3-d592-41b9-89c8-69d7d4afe1a6))
|
||||
(pad "46" thru_hole circle (at -0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp eb6dc916-572e-4e6b-8dcd-33c4e7deeaf9))
|
||||
(pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023)
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 02a80d3d-937f-4e46-bedb-fc8d24b4bc7e))
|
||||
(pad "47" thru_hole circle (at -1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 1bb3fd22-17bc-448c-8d99-27225f27ed91))
|
||||
(pad "47" thru_hole circle (at 1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 610ccbde-9a49-4710-a67a-62a47174c923))
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 2e438b0b-cc8b-4161-adbe-29f40e63bd62))
|
||||
(pad "47" thru_hole circle (at 0 0.55) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 528cdda1-08a6-489c-8f4c-f3f4d29f1f20))
|
||||
(pad "47" thru_hole circle (at -1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 73c70fb1-bfce-4cb6-b1a8-d74f02ada4fc))
|
||||
(pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.023)
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp b4290e1a-2c26-4127-a289-37a0c680fb49))
|
||||
(pad "47" thru_hole circle (at 0 0.55) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp c4b251dd-0dc1-452d-9af7-8bcdc4f66331))
|
||||
(pad "47" thru_hole circle (at 0 2.2) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp c5763d72-59e1-48cf-8d2d-425ae275b6b9))
|
||||
(pad "47" thru_hole circle (at 0 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp d2a07ec0-e70a-4600-b2cd-6c0170f44e18))
|
||||
(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp a25d19c7-1e64-4880-8b89-f5333294f14b))
|
||||
(pad "47" thru_hole circle (at 0 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp a5507238-a3fd-47e9-aa4e-191a6f018ba3))
|
||||
(pad "47" thru_hole circle (at 0 2.2) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b4aa4dea-0b79-40c4-928e-d25a66cfaa34))
|
||||
(pad "47" thru_hole circle (at 1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp ba448c00-a035-496f-885e-ecf501372b3e))
|
||||
(model "${KISYS3DMOD}/Package_DFN_QFN.3dshapes/Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm.wrl"
|
||||
(offset (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
|
||||
Reference in New Issue
Block a user