(footprint "Texas_VQFN-47-2EP_5x7mm_P0.4mm_ThermalVias" (version 20210108) (generator pcbnew) (layer "F.Cu") (tedit 6022E559) (descr "45-Lead Plastic Quad Flat, No Lead Package - 5x7x1mm Body (https://www.ti.com/lit/ds/symlink/tps23734.pdf)") (tags "VQFN 0.4") (attr smd) (fp_text reference "REF**" (at 0 -4.7) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))) (tstamp db3f15f2-21c6-4e9e-a638-1299dff4bb1e) ) (fp_text value "Texas_VQFN-47-2EP_5x7mm_P0.4mm" (at 0 4.9) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp d6fec916-d952-47e1-b383-7490a9de71b8) ) (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp bc411d5e-a1ca-4333-9412-97cb3d59f578) ) (fp_line (start 2.7 3.7) (end 2.7 3.1) (layer "F.SilkS") (width 0.15) (tstamp 07931c38-b1a7-4c58-9d53-29d05442fb0f)) (fp_line (start -2.7 3.7) (end -2.1 3.7) (layer "F.SilkS") (width 0.15) (tstamp 30ccefc0-7d8b-4073-9c58-e4d7d5115f64)) (fp_line (start 2.7 3.7) (end 2.1 3.7) (layer "F.SilkS") (width 0.15) (tstamp 3452bcce-925f-4649-b6ef-59e6662985f0)) (fp_line (start 2.7 -3.7) (end 2.7 -3.1) (layer "F.SilkS") (width 0.15) (tstamp 86b43f57-2115-43ee-b014-600daf2dd416)) (fp_line (start 2.7 -3.7) (end 2.1 -3.7) (layer "F.SilkS") (width 0.15) (tstamp ae889e65-7309-4ef8-9b01-0e481ee5b1b3)) (fp_line (start -2.7 -3.7) (end -2.1 -3.7) (layer "F.SilkS") (width 0.15) (tstamp d8ad7df8-b69b-4fda-b10c-75985149488f)) (fp_line (start -2.7 3.7) (end -2.7 3.1) (layer "F.SilkS") (width 0.15) (tstamp d8deeea0-f467-43c3-8705-039fb1a6a7ac)) (fp_line (start -3 4) (end 3 4) (layer "F.CrtYd") (width 0.05) (tstamp 37f22777-77f4-4a72-9b82-34b9ee7f8b5d)) (fp_line (start 3 -4) (end 3 4) (layer "F.CrtYd") (width 0.05) (tstamp 4c7f39c1-eb92-439a-bad9-fe4f56418af4)) (fp_line (start -3 -4) (end 3 -4) (layer "F.CrtYd") (width 0.05) (tstamp 64ef6da2-0872-45c1-8341-c9aee034e0eb)) (fp_line (start -3 -4) (end -3 4) (layer "F.CrtYd") (width 0.05) (tstamp cbe146c3-4c59-41ea-b054-e57088c51cc0)) (fp_line (start -2.5 3.5) (end -2.5 -2.5) (layer "F.Fab") (width 0.15) (tstamp 2e59e147-c2c3-4365-9cdc-d6d502705465)) (fp_line (start -1.5 -3.5) (end 2.5 -3.5) (layer "F.Fab") (width 0.15) (tstamp 39d5209a-f1c1-4da7-8c6b-65cd9c551e70)) (fp_line (start 2.5 3.5) (end -2.5 3.5) (layer "F.Fab") (width 0.15) (tstamp 476e7936-fb82-4893-8813-cad1a0adf6c7)) (fp_line (start 2.5 -3.5) (end 2.5 3.5) (layer "F.Fab") (width 0.15) (tstamp b612cab1-37b5-41b0-9fb8-26f883308312)) (fp_line (start -2.5 -2.5) (end -1.5 -3.5) (layer "F.Fab") (width 0.15) (tstamp ec91e5e0-0151-47c6-948c-5ac8511fc0f8)) (pad "" smd roundrect (at 1.25 -1.97) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp 0dffc99b-9582-4180-a213-7da37a2c0c66)) (pad "" smd roundrect (at 1.25 -0.83) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp 19900918-0206-4ccc-8b10-4ae892574383)) (pad "" smd roundrect (at 0 -0.83) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp 287851db-8648-4970-8e1c-b80911530eaf)) (pad "" smd roundrect (at -0.735 1.955) (locked) (size 1.27 0.96) (layers "F.Paste") (roundrect_rratio 0.052) (solder_paste_margin_ratio -0.2) (tstamp 56abfb67-e5bc-49a4-ab3a-a6363ecebfc4)) (pad "" smd roundrect (at -1.25 -0.83) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp 5990204c-4b44-4fb8-9b65-89e4e7631481)) (pad "" smd roundrect (at 0.735 0.795) (locked) (size 1.27 0.96) (layers "F.Paste") (roundrect_rratio 0.052) (solder_paste_margin_ratio -0.2) (tstamp 8b441b88-b171-44a8-be94-64eb7037d535)) (pad "" smd roundrect (at -0.735 0.795) (locked) (size 1.27 0.96) (layers "F.Paste") (roundrect_rratio 0.052) (solder_paste_margin_ratio -0.2) (tstamp 8b5b0af5-ae14-4b5b-9069-e6faae95276f)) (pad "" smd roundrect (at 0 -1.97) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp 93b9d7fe-dce8-4ff1-979a-48d2fa065d13)) (pad "" smd roundrect (at 0.735 1.955) (locked) (size 1.27 0.96) (layers "F.Paste") (roundrect_rratio 0.052) (solder_paste_margin_ratio -0.2) (tstamp af583c33-eef2-46f3-b3f7-78af0b73aa76)) (pad "" smd roundrect (at -1.25 -1.97) (locked) (size 1.05 0.94) (layers "F.Paste") (roundrect_rratio 0.053) (solder_paste_margin_ratio -0.2) (tstamp d394c606-4a61-498e-899e-0fb8f3d6e559)) (pad "1" smd roundrect (at -2.4 -2.6) (locked) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 82d625b7-be11-4680-b5a2-eb9d386b496e)) (pad "2" smd roundrect (at -2.4 -2.2) (locked) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp d44c4e36-f40a-4811-9dc1-15b0f2e56f5c)) (pad "3" smd roundrect (at -2.4 -1.8) (locked) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 91a833a7-989a-46b0-ae72-79e70c9620f4)) (pad "4" smd roundrect (at -2.4 -1.4) (locked) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp a221c354-7c55-4f7d-95d1-3702d3670416)) (pad "5" smd roundrect (at -2.4 -1) (locked) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 4e210717-854c-47d1-bf27-fe47f2ddc54e)) (pad "6" smd roundrect (at -2.4 -0.6) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 8a29163a-4397-4cc1-bd42-fd94144e7787)) (pad "7" smd roundrect (at -2.4 -0.2) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp f9eedd88-a5b4-4343-abfa-229bcdda0e70)) (pad "8" smd roundrect (at -2.4 0.2) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp f2731bc7-cede-4fbd-bb04-9d0279bf15fa)) (pad "9" smd roundrect (at -2.4 0.6) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp dc82a13b-b477-493f-bad1-65dd27e3fe96)) (pad "10" smd roundrect (at -2.4 1.4) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 8e78eec0-9cea-4b7c-88de-e95dbda36e98)) (pad "11" smd roundrect (at -2.4 1.8) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 54521bc4-8142-4b04-9514-afc672233811)) (pad "12" smd roundrect (at -2.4 2.2) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 6cb02741-e0c8-4fcd-9230-13c6d11d2a45)) (pad "13" smd roundrect (at -2.4 2.6) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 23ce1f87-3f87-4668-affd-f070b5205c99)) (pad "14" smd roundrect (at -1.8 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp d4c1fd07-0619-4f83-8e9a-951182fa202b)) (pad "15" smd roundrect (at -1.4 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp a599841c-42ef-4a14-8ff5-ee0a23236d73)) (pad "16" smd roundrect (at -1 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 908339bb-078d-40ac-baad-166611cf4c0f)) (pad "17" smd roundrect (at -0.6 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp f40d0c5d-8ba0-4a5e-a9a2-37ab90d85e5a)) (pad "18" smd roundrect (at -0.2 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 2c4985a3-e348-4247-98bf-c806d84516ba)) (pad "19" smd roundrect (at 0.2 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp ea831c3d-3eb1-48ae-ba98-1568493878b7)) (pad "20" smd roundrect (at 0.6 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 8d9f40dc-a789-4e78-bda3-a065c31da3ca)) (pad "21" smd roundrect (at 1 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 90a75045-e92a-41b6-936c-b31790bae1e0)) (pad "22" smd roundrect (at 1.4 3.4 90) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 09b098a8-b0e8-4c5d-9e5b-cead7dd8a563)) (pad "23" smd roundrect (at 2.4 2.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp ab19328f-57aa-40ef-bf7e-68b24d706d45)) (pad "24" smd roundrect (at 2.4 2.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp bee02625-8a08-4907-9d59-4afc8ead7e82)) (pad "25" smd roundrect (at 2.4 1.8 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 2af995dd-824a-4c12-b740-877c22e7b342)) (pad "26" smd roundrect (at 2.4 1.4 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 53986ca8-930a-4d4d-92c3-bf4cb4dda8fe)) (pad "27" smd roundrect (at 2.4 1 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp af3e7859-8d76-4e75-ad50-cbea33fe2031)) (pad "28" smd roundrect (at 2.4 0.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp b40e904f-6a94-49d3-8668-af3d99d629ea)) (pad "29" smd roundrect (at 2.4 0.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 0d6973d9-0f74-41db-9e92-bddc177a2f72)) (pad "30" smd roundrect (at 2.4 -0.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 759242ee-78f2-4549-a8f6-11dbd4e3ebe2)) (pad "31" smd roundrect (at 2.4 -1 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp c91ecca8-4b70-4725-8449-da090e73d4b5)) (pad "32" smd roundrect (at 2.4 -1.4 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp fd169f9d-4c36-47a7-8a13-084723825057)) (pad "33" smd roundrect (at 2.4 -1.8 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 68543a4a-c64c-432c-a4b9-47a45f27f806)) (pad "34" smd roundrect (at 2.4 -2.2 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp ee6fc1f9-fc6f-43d0-b5e9-0874226bf693)) (pad "35" smd roundrect (at 2.4 -2.6 180) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 4d1c8ad8-b4dc-4a35-bd99-a31e4b0440a9)) (pad "36" smd roundrect (at 1.8 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 67ed900b-00cb-4b6b-8f35-e8aa3b683601)) (pad "37" smd roundrect (at 1.4 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 2da475f8-cdfc-4156-b3b1-358db3f4ba9f)) (pad "38" smd roundrect (at 1 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 618c8ff2-7f83-4b30-800c-144525690a45)) (pad "39" smd roundrect (at 0.6 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp c63cfd9f-d4c1-42a9-a88a-935ffecb7807)) (pad "40" smd roundrect (at 0.2 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp bbdfb2d3-8e4e-416c-94da-d8e5abb97540)) (pad "41" smd roundrect (at -0.2 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 5093be61-171e-4ac5-868c-f04a2c60206d)) (pad "42" smd roundrect (at -0.6 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp fa45f016-353e-4f7d-b5d7-9a0e69bf1216)) (pad "43" smd roundrect (at -1 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp 3df131c7-f913-4505-8e57-71dab04241ac)) (pad "44" smd roundrect (at -1.4 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp abfd2beb-3bee-490e-90ba-ed68e75e05c8)) (pad "45" smd roundrect (at -1.8 -3.4 270) (size 0.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (solder_mask_margin 0.05) (tstamp e03ad232-4b86-457c-8f44-086721e06e74)) (pad "46" thru_hole circle (at -0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 0df109ad-318a-40ab-b222-c17cfffdfcd3)) (pad "46" smd roundrect (at 0 -1.4) (locked) (size 3.7 2.1) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.023) (solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 4c4302f5-d5e4-48ee-ad03-735cd6f25a4a)) (pad "46" thru_hole circle (at 1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 5bf85ca7-e194-43e4-8908-1a486678d3c2)) (pad "46" thru_hole circle (at 0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 67244f40-5845-4f65-917e-b134f7473062)) (pad "46" thru_hole circle (at -0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 732d989d-308a-4f7a-9045-9a81a64900a0)) (pad "46" thru_hole circle (at 0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 8e2225f1-fef2-46b4-ad98-2a78c393257f)) (pad "46" thru_hole circle (at 0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b44be243-3ac0-4a9e-8a4f-c921c2cd8cf1)) (pad "46" thru_hole circle (at -1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b86f8b76-f412-4884-80a9-517992597c85)) (pad "46" smd roundrect (at 0 -1.4) (locked) (size 3.7 2.1) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023) (solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp ba9efbc3-d592-41b9-89c8-69d7d4afe1a6)) (pad "46" thru_hole circle (at -0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp eb6dc916-572e-4e6b-8dcd-33c4e7deeaf9)) (pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023) (solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 2e438b0b-cc8b-4161-adbe-29f40e63bd62)) (pad "47" thru_hole circle (at 0 0.55) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 528cdda1-08a6-489c-8f4c-f3f4d29f1f20)) (pad "47" thru_hole circle (at -1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 73c70fb1-bfce-4cb6-b1a8-d74f02ada4fc)) (pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.023) (solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp a25d19c7-1e64-4880-8b89-f5333294f14b)) (pad "47" thru_hole circle (at 0 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp a5507238-a3fd-47e9-aa4e-191a6f018ba3)) (pad "47" thru_hole circle (at 0 2.2) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b4aa4dea-0b79-40c4-928e-d25a66cfaa34)) (pad "47" thru_hole circle (at 1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp ba448c00-a035-496f-885e-ecf501372b3e)) (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )