mirror of
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171 lines
16 KiB
Plaintext
171 lines
16 KiB
Plaintext
(footprint "Texas_VQFN-47-2EP_5x7mm_P0.4mm_ThermalVias" (version 20210108) (generator pcbnew) (layer "F.Cu")
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(tedit 6022E559)
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(descr "45-Lead Plastic Quad Flat, No Lead Package - 5x7x1mm Body (https://www.ti.com/lit/ds/symlink/tps23734.pdf)")
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(tags "VQFN 0.4")
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(attr smd)
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(tstamp db3f15f2-21c6-4e9e-a638-1299dff4bb1e)
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)
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(pad "46" thru_hole circle (at 0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 67244f40-5845-4f65-917e-b134f7473062))
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(pad "46" thru_hole circle (at -0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 732d989d-308a-4f7a-9045-9a81a64900a0))
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(pad "46" thru_hole circle (at 0.625 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 8e2225f1-fef2-46b4-ad98-2a78c393257f))
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(pad "46" thru_hole circle (at 0.625 -0.595) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b44be243-3ac0-4a9e-8a4f-c921c2cd8cf1))
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(pad "46" thru_hole circle (at -1.6 -1.4) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b86f8b76-f412-4884-80a9-517992597c85))
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(pad "46" smd roundrect (at 0 -1.4) (locked) (size 3.7 2.1) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023)
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(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp ba9efbc3-d592-41b9-89c8-69d7d4afe1a6))
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(pad "46" thru_hole circle (at -0.625 -2.205) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp eb6dc916-572e-4e6b-8dcd-33c4e7deeaf9))
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(pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.023)
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(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp 2e438b0b-cc8b-4161-adbe-29f40e63bd62))
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(pad "47" thru_hole circle (at 0 0.55) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 528cdda1-08a6-489c-8f4c-f3f4d29f1f20))
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(pad "47" thru_hole circle (at -1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp 73c70fb1-bfce-4cb6-b1a8-d74f02ada4fc))
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(pad "47" smd roundrect (at 0 1.375) (locked) (size 2.9 2.15) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.023)
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(solder_mask_margin -0.155) (solder_paste_margin_ratio -0.2) (tstamp a25d19c7-1e64-4880-8b89-f5333294f14b))
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(pad "47" thru_hole circle (at 0 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp a5507238-a3fd-47e9-aa4e-191a6f018ba3))
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(pad "47" thru_hole circle (at 0 2.2) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp b4aa4dea-0b79-40c4-928e-d25a66cfaa34))
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(pad "47" thru_hole circle (at 1.2 1.375) (locked) (size 0.5 0.5) (drill 0.2) (layers *.Cu *.Mask) (tstamp ba448c00-a035-496f-885e-ecf501372b3e))
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(model "${KISYS3DMOD}/Package_DFN_QFN.3dshapes/Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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