40 lines
1.8 KiB
Plaintext
40 lines
1.8 KiB
Plaintext
(footprint "0805-NO" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(fp_text reference "REF**" (at 2.032 0.127) (layer "F.SilkS")
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(effects (font (size 0.666496 0.666496) (thickness 0.146304)) (justify left bottom))
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(tstamp 2b8acbda-e2fb-4512-bb62-1f2121a529e9)
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)
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(fp_text value "0805-NO" (at 2.032 0.762) (layer "F.Fab")
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(effects (font (size 0.36576 0.36576) (thickness 0.04064)) (justify left bottom))
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(tstamp c1b1f6a9-3487-46c5-a91c-faabdca3a5b6)
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)
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(fp_line (start 0 -0.508) (end 0 0.508)
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(stroke (width 0.3048) (type solid)) (layer "F.SilkS") (tstamp 3e861bb9-87c3-450c-af23-d4b7b6693f82))
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(fp_line (start -0.381 -0.66) (end 0.381 -0.66)
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(stroke (width 0.1016) (type solid)) (layer "F.Fab") (tstamp eb26aae3-463c-4eaf-bf46-ff1e0646d191))
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(fp_line (start -0.356 0.66) (end 0.381 0.66)
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(stroke (width 0.1016) (type solid)) (layer "F.Fab") (tstamp b49f9cd0-617d-4128-b0f9-9d8dc10aad1e))
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(fp_poly
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(pts
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(xy -1.0922 0.7239)
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(xy -0.3421 0.7239)
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(xy -0.3421 -0.7262)
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(xy -1.0922 -0.7262)
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)
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(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp f24d2644-4879-4747-8c2b-5a9f1d80dab0))
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(fp_poly
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(pts
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(xy 0.3556 0.7239)
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(xy 1.1057 0.7239)
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(xy 1.1057 -0.7262)
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(xy 0.3556 -0.7262)
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)
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(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp fd8ef17b-600e-439c-8fae-edc481be448a))
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(pad "1" smd rect (at -0.95 0) (size 1.24 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp e3625fc0-d3e8-4d00-a452-11db864aa285))
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(pad "2" smd rect (at 0.95 0) (size 1.24 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (thermal_bridge_angle 45) (tstamp 2050f25e-d3bf-4cd0-bfd4-c8923b7bef74))
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)
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