81 lines
4.7 KiB
Plaintext
81 lines
4.7 KiB
Plaintext
(module NANO (layer F.Cu) (tedit 0)
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(fp_text reference U$1 (at 0 0) (layer F.SilkS) hide
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(effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top))
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)
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(fp_text value NANO (at 0 0) (layer F.SilkS) hide
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(effects (font (size 1.27 1.27) (thickness 0.15)) (justify right top))
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)
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(pad TX0 thru_hole oval (at 5.08 8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad RX1 thru_hole oval (at 5.08 6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad RST1 thru_hole oval (at 5.08 3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad GND1 thru_hole oval (at 5.08 1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D2 thru_hole oval (at 5.08 -1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D3 thru_hole oval (at 5.08 -3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D4 thru_hole oval (at 5.08 -6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D5 thru_hole oval (at 5.08 -8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D6 thru_hole oval (at 5.08 -11.43) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D7 thru_hole oval (at 5.08 -13.97) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D8 thru_hole oval (at 5.08 -16.51) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D9 thru_hole oval (at 5.08 -19.05) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad RAW thru_hole oval (at -10.16 8.89) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad GND thru_hole oval (at -10.16 6.35) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad RST thru_hole oval (at -10.16 3.81) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A3 thru_hole oval (at -10.16 -11.43) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A2 thru_hole oval (at -10.16 -13.97) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A1 thru_hole oval (at -10.16 -16.51) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A0 thru_hole oval (at -10.16 -19.05) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D13 thru_hole oval (at -10.16 -26.67) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D12 thru_hole oval (at 5.08 -26.67) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D11 thru_hole oval (at 5.08 -24.13) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad D10 thru_hole oval (at 5.08 -21.59) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad 3.3V thru_hole oval (at -10.16 -24.13 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad AREF thru_hole oval (at -10.16 -21.59 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad 5V thru_hole oval (at -10.16 1.27) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP2 thru_hole circle (at -5.08 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP4 thru_hole circle (at -2.54 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP6 thru_hole circle (at 0 7.62 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A4 thru_hole oval (at -10.16 -8.89 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A5 thru_hole oval (at -10.16 -6.35 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A6 thru_hole oval (at -10.16 -3.81 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad A7 thru_hole oval (at -10.16 -1.27 180) (size 2.4 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP1 thru_hole circle (at -5.08 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP3 thru_hole circle (at -2.54 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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(pad ICSP5 thru_hole circle (at 0 10.16 90) (size 1.2 1.2) (drill 0.8) (layers *.Cu *.Mask)
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(solder_mask_margin 0.1016))
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)
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