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Update newer footprints mask and paste clearance

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This commit is contained in:
Zane Kaminski
2021-02-04 23:40:03 -05:00
parent 5dd6a9add4
commit 0f55fdf371
5 changed files with 27 additions and 12 deletions
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4
D_MiniMELF.kicad_mod
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@@ -1,6 +1,8 @@
(module D_MiniMELF (layer F.Cu) (tedit 601CACBE)
(module D_MiniMELF (layer F.Cu) (tedit 601CCB74)
(descr "Diode Mini-MELF")
(tags "Diode Mini-MELF")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0.95 -0.4) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))

4
SW_DIP_SPSTx08_Slide_DSHP08TS_P1.27mm.kicad_mod
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@@ -1,6 +1,8 @@
(module SW_DIP_SPSTx08_Slide_DSHP08TS_P1.27mm (layer F.Cu) (tedit 5FDA01A3)
(module SW_DIP_SPSTx08_Slide_DSHP08TS_P1.27mm (layer F.Cu) (tedit 601CCB8E)
(descr "SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf)")
(tags "SMD DIP Switch SPST Slide 7.62mm 300mil")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0 -1.905 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))

8
Sunlord_MWSA0402.kicad_mod
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@@ -1,6 +1,8 @@
(module Sunlord_MWSA0402 (layer F.Cu) (tedit 601CACD8)
(module Sunlord_MWSA0402 (layer F.Cu) (tedit 601CCB69)
(descr "Choke, SMD, 6.3x6.3mm 3mm height")
(tags "Choke SMD")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
@@ -29,8 +31,8 @@
(fp_line (start -2.1 2.1) (end 2.1 2.1) (layer F.Fab) (width 0.1))
(fp_arc (start 0 0) (end -1.2 -1.2) (angle 90) (layer F.Fab) (width 0.1))
(fp_arc (start 0 0) (end 1.2 1.2) (angle 90) (layer F.Fab) (width 0.1))
(pad 1 smd rect (at -1.85 0) (size 1.5 2.5) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 1.85 0) (size 1.5 2.5) (layers F.Cu F.Paste F.Mask))
(pad 1 smd roundrect (at -1.85 0) (size 1.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at 1.85 0) (size 1.5 2.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Bourns_SRR1260.wrl
(at (xyz 0 0 0))
(scale (xyz 0.33 0.33 0.33))

19
USB_Micro-B_ShouHan_MicroXNJ.kicad_mod
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@@ -1,6 +1,8 @@
(module USB_Micro-B_ShouHan_MicroXNJ (layer F.Cu) (tedit 601CC892)
(module USB_Micro-B_ShouHan_MicroXNJ (layer F.Cu) (tedit 601CCB0A)
(descr http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf)
(tags "Micro-USB SMD Typ-B")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0 -0.05) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
@@ -40,11 +42,16 @@
(pad 6 thru_hole oval (at -3.6 1.25 180) (size 1.07 1.9) (drill oval 0.5 1.3) (layers *.Cu *.Mask))
(pad 6 smd roundrect (at -0.8 1.275) (size 0.6 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 6 thru_hole circle (at 2.425 -1.4) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask))
(pad 3 smd roundrect (at 0 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 4 smd roundrect (at 0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 5 smd roundrect (at 1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 1 smd roundrect (at -1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 2 smd roundrect (at -0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 3 smd roundrect (at 0 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 4 smd roundrect (at 0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 5 smd roundrect (at 1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 1 smd roundrect (at -1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 2 smd roundrect (at -0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 6 thru_hole circle (at -2.425 -1.4) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask))
(pad 6 smd roundrect (at 0.8 1.275) (size 0.6 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl

4
XKB_TS-1187A.kicad_mod
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@@ -1,6 +1,8 @@
(module XKB_TS-1187A (layer F.Cu) (tedit 601CAD3D)
(module XKB_TS-1187A (layer F.Cu) (tedit 601CC9F1)
(descr "XKB Components SPST SMD TS-1187A Series 5.1mm Tact Switch")
(tags "SPST Button Switch")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0 0) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))