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Update newer footprints mask and paste clearance

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This commit is contained in:
Zane Kaminski
2021-02-04 23:40:03 -05:00
parent 5dd6a9add4
commit 0f55fdf371
5 changed files with 27 additions and 12 deletions
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19
USB_Micro-B_ShouHan_MicroXNJ.kicad_mod
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@@ -1,6 +1,8 @@
(module USB_Micro-B_ShouHan_MicroXNJ (layer F.Cu) (tedit 601CC892)
(module USB_Micro-B_ShouHan_MicroXNJ (layer F.Cu) (tedit 601CCB0A)
(descr http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf)
(tags "Micro-USB SMD Typ-B")
(solder_mask_margin 0.05)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference REF** (at 0 -0.05) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
@@ -40,11 +42,16 @@
(pad 6 thru_hole oval (at -3.6 1.25 180) (size 1.07 1.9) (drill oval 0.5 1.3) (layers *.Cu *.Mask))
(pad 6 smd roundrect (at -0.8 1.275) (size 0.6 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 6 thru_hole circle (at 2.425 -1.4) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask))
(pad 3 smd roundrect (at 0 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 4 smd roundrect (at 0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 5 smd roundrect (at 1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 1 smd roundrect (at -1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 2 smd roundrect (at -0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2))
(pad 3 smd roundrect (at 0 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 4 smd roundrect (at 0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 5 smd roundrect (at 1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 1 smd roundrect (at -1.3 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 2 smd roundrect (at -0.65 -1.375) (size 0.4 1.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.2)
(solder_mask_margin 0.04) (solder_paste_margin -0.05))
(pad 6 thru_hole circle (at -2.425 -1.4) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask))
(pad 6 smd roundrect (at 0.8 1.275) (size 0.6 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl