Redesign the back silk screen. The new print provides space for a
larger label (32x19mm), uses the new Powered By Raspberry Pi logo and
prints "Made in PRC" onto the PCB.
Fixes: #52, #55
Signed-off-by: Stefan Agner <stefan@agner.ch>
Use the recommended hole size of 4.22mm. Make the outer diameter
slightly larger than specified as minimum to allow more space for excess
solder.
Fixes: #54
Signed-off-by: Stefan Agner <stefan@agner.ch>
Adjust silk screen graphics to match current layout. Adjust silk screen
reference designator placements. Bump date and version of schematics and
PCB.
Signed-off-by: Stefan Agner <stefan@agner.ch>
-eth shield is not connected to the GND rather it shields "input" of poe
-used smaller package for bulk PoE capacitor
-Changed common mode filter to Pulse T8113
-Added more inductor filters on the primary side
-replaced secondary side ferrite silter with an inductor
-used distributed "flyback" capacitor (3 instead of 1)
-slightly increased distance between the poe transformer and the
ethernet signal traces
- extended GND1 under the transformer
- primary snubber circuit is now in "hot-loop" area
-repositioned poe enable optocoupler
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
- Place reference properly
- Move and update Wireless smart-home text
- Move and update PoE+ text
- Readd symbols and back silkscreen (with proper attributes)
Signed-off-by: Stefan Agner <stefan@agner.ch>
- Fix edge cut on lower right corner to make board size exact
- Update board charactristics
- Set grid origin back to 30, 30
- Update M.2 expansion silk screen (remove AI accelerator hint)
- Various silk screen reference designator fixes/improvements
- Add ESD warning logo
Signed-off-by: Stefan Agner <stefan@agner.ch>
