The MOSFET 3D model did not fit the footprint, select a matching model.
Also adjust 5V routing to avoid an unnecessary via.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Move the RPi LEDs closer to the CM4 to make space for PCB Art in the top
right corner.
Fix Silkscreen accross the whole board.
Signed-off-by: Stefan Agner <stefan@agner.ch>
All new footprints refer to the 3D model by using KICAD6_3DMODEL_DIR.
Update the footprints in .kicad_pcb to do the same.
Signed-off-by: Stefan Agner <stefan@agner.ch>
updates
schematic:
-change usb current protection IC to 1.5A
-Added low-pass filter to the audio output
-PoE fixed primary windings polarity
-added option to select poe class with a jumper (between 3 and 4)
-fixes in poe design
-added testpoints
-added virtual hirose df40c connectors for pick and place use
lightblue.pretty:
-added fake DF40C footprint for pick and place and 3d model purposes
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
Make the heat sink footprint to represent the real heatsink without
rotation and the correct outer dimension (56x56mm). Also position the
heatsink centered on the CM4 SoC.
Signed-off-by: Stefan Agner <stefan@agner.ch>
- Add multiple ventilation slots (move some traces for space)
- Add Home Assistant logo to the back
- Add Nabu Casa logo on the front
- Fixup reference designators placement in several cases
Signed-off-by: Stefan Agner <stefan@agner.ch>
Order some relevant reference designator. Use JP for all jumpers. Place
silkcreen neatly. Add some custom silk screen. Remove heat sink corner
marks on silk screen.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Changes:
Footrints:
-Modified DC Jack to accomodate CUI PJ-002A
-Modified RJ45 to increase clearance between shield and poe pins
-Modified m.2 mounting pads to avoid drc errors
Schematic:
-usb-c facing usb mux is supplied by +3v3VP
-added misc. capacitors
PCB
-min. annular ring for vias set to 0.125 from 0.2
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
The current M2.5 holes work well for the soldered nuts from JAE
(SM3ZS067U310-NUT1-R1800). However, we are going to use a custom
standoff with a M2 thread (nut) and a screw to mechanically secure the
NVMe. The nut will have a border to fit the hole. That the standoff
still can fit a M2 thread we need M3 holes.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Use a through hole 3.5mm Audio jack to make sure it does nto get teared
off the board accidentially that easily.
Fixes: #9
Signed-off-by: Stefan Agner <stefan@agner.ch>
Make sure the right path to 3D models is set in various footprints on
the PCB. Assign the M.2 footprint from our 3D library.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Make sure the courtyards is defined such only the zones which are
relevant for regular component placing are excluded.
Signed-off-by: Stefan Agner <stefan@agner.ch>
changes:
-more routing
-added poe negotiation disabled when +12V is present on the DC jack
-modified m.2 "holes"
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
The 1- at the start of the part number denotes M-Key which is a rather
important distinction. Fix the footprint name.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Add repository with 3D models as git submodule to the repository and
reference our footprints to the matching 3D models.
Signed-off-by: Stefan Agner <stefan@agner.ch>
- Fix footprint for 02x05 pin header
- Add footprint for Bourns SDR1006 Inductor (PoE)
- Define footprints for inductors
- Define footprints for ferrite beads
- Define footprint for fuse
- Define footprints for all resistors
- Define footprints for SD card and other components
- Switch ON Semi NCP114MX with TI TLV73333PDBV
Signed-off-by: Stefan Agner <stefan@agner.ch>
Add footprint for PoE controller TI TPS23734. Also fix/readd
Manufacturer which somehow got lost when opening.
Signed-off-by: Stefan Agner <stefan@agner.ch>
Add 3.5mm Audio plug footprint for CUI SJ2-35953A-SMT-TR and assign it.
Define Config to be +Audio for audio components.
Signed-off-by: Stefan Agner <stefan@agner.ch>
