Improve/fix most silk screen placement of most parts. Decrease size to
0.8mm by 0.8mm and 0.15mm thickness which works for most PCB manufacturers.
Signed-off-by: Stefan Agner <stefan@agner.ch>
changes:
-more routing
-added poe negotiation disabled when +12V is present on the DC jack
-modified m.2 "holes"
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
- Moved PoE to a seperate sheet and finished design
- Started using Config field for Variants and DNP flag
- Fix-ups
- Added Wurth 749119550 and TI TPS23734 to the symbol library
- Changed RTC from PCF8563 to PCF85063
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
-Added sdcard sheet and SD bus
-changed main i2c bus
-added 1.8V and 3.3V connection to CM4
-removed clk32 from led driver
-fixed PCM interface Data pin
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
-Added AP64501SP-13 library symbol
-Initial power supplies schematics
-Increased capacitance for PCIe socket
-Connections between sheets
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
-Added net classes for controlled impedance traces
-Added power hierarchical sheet
-Initial USB subsystem schematic
-Added multiple bus definitions (usb, pcie, i2c etc.)
-Fixed busses use
-Added LDO for audio analog rails
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
