Commit Graph

269 Commits

Author SHA1 Message Date
Stefan Agner
35ae47b917 Adjust CR2032 battery holder footprint
Increase the pad size of the CR2032 battery holder to ensure good
solder joints.

Also refill and updated settings for gerber export.

Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.3d
2023-02-06 15:35:16 +01:00
Stefan Agner
f4548d292a Update README.md
Co-authored-by: Paulus Schoutsen <paulus@home-assistant.io>
2023-01-20 17:55:13 +01:00
Stefan Agner
36d8cd45b9 Add README.md
Signed-off-by: Stefan Agner <stefan@agner.ch>
2023-01-20 17:55:13 +01:00
Stefan Agner
210562ccad Add LICENSE.md files for Home Assistant Yellow
Signed-off-by: Stefan Agner <stefan@agner.ch>
2023-01-20 16:31:29 +01:00
Stefan Agner
8957b440ad Set manufacturer and part number of SMT stand-off/SW3
Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.3c
2022-12-05 00:33:52 +01:00
Dominik Sliwa
4f93a4d880 Yello_PCB: expand keepout area for the CM4 wireless antenna
Due to gnd pour expansion keepout was insufficient.
2022-12-04 23:48:21 +01:00
Stefan Agner
78b78e172b Bump to Yellow v1.3b
Update 3D model locations and bump dates and versions.

Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.3b
2022-11-06 18:52:46 +01:00
Dominik Sliwa
29fb9d1437 update to the latest symbols and footprints
Update SMTSO2515CTJ standoff and D3 to latest upstream
2022-11-06 17:43:19 +01:00
Dominik Sliwa
89797bc966 Yellow.pretty: SMTSO2515CTJ modified
Remove through hole plating and enforce thermal relieves
2022-11-06 17:42:04 +01:00
Dominik Sliwa
239d2b8ca7 PCB: updated SMTSO2515CTJ footprint 2022-11-05 13:44:13 +01:00
Dominik Sliwa
5f0313ca2b Yello.pretty: added solderpaste to SMTSO2515CTJ 2022-11-05 13:43:27 +01:00
Dominik Sliwa
833fb14f29 Added cm4 standoffs, usb rec. button, DC_IN pull-down
Added:
- solderable standoffs for the CM4
- DC_IN_F pulldown for D2 high temp reverse current control R44
Modified:
- USB recovery jumper JP2 replaced with a button SW3
- R64 changed to 33k from 6.8k
2022-11-04 20:50:58 +01:00
Dominik Sliwa
682524a0b8 Yellow.pretty: new footprints and modificaion of existing ones
Added:
- 4.5x4.5mm smd button
- M2.5 H=1.5mm standoff
Added/Modified:
- HTSOP-8 copied from kicad library and added more thermal vias
- CM4 remove drills from the mounting holes
2022-11-04 20:50:17 +01:00
Stefan Agner
c7330970d9 Redesign back silk screen for larger label
Redesign the back silk screen. The new print provides space for a
larger label (32x19mm), uses the new Powered By Raspberry Pi logo and
prints "Made in PRC" onto the PCB.

Fixes: #52, #55

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-11-04 16:40:42 +01:00
Stefan Agner
037dbdb0be Increase hole size to fit M2.5 SMT stand-off nut
Use the recommended hole size of 4.22mm. Make the outer diameter
slightly larger than specified as minimum to allow more space for excess
solder.

Fixes: #54

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-11-04 11:12:51 +01:00
Stefan Agner
fc605c3494 Change U29 to actual part used in production
We are using the onsemi LM431SACM3X alternative in mass production.

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-11-01 12:02:37 +01:00
Stefan Agner
0b0907c70d Mark JP5 PoE only
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-10-13 20:44:21 +02:00
Stefan Agner
75b1197ca8 Use 0.05Ohm for R60
Previous versions used R44/R60 with 0.1Ohm in parallel for easier
testing. However, with the final version, only the frootprint for
R60 is in the layout, hence it has to be 0.05Ohm.

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-10-10 22:33:19 +02:00
Stefan Agner
80abbc30b5 Use colorized tactile switches
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-10-09 16:29:22 +02:00
Stefan Agner
bda6dfe20c Readd UKCA marking
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-09-15 15:05:19 +02:00
Stefan Agner
e81a510caf Merge branch 'poe_13_rc1' into main v1.3 2022-08-29 23:59:05 +02:00
Stefan Agner
8a27651878 Update silk screen and board version
Adjust silk screen graphics to match current layout. Adjust silk screen
reference designator placements. Bump date and version of schematics and
PCB.

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-08-29 18:40:06 +02:00
Stefan Agner
7dac247dfd BOM adjustments
Various BOM adjustments, most notably setting/correcting manufacturer
and part number information for D22, D30, FL1, L4 and L5.

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-08-29 10:17:39 +02:00
Dominik Sliwa
e4cf2747aa Yellow 1.3 PCB 2022-08-29 09:09:51 +02:00
Dominik Sliwa
ed7895607b Small layout adjustments and more vias
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-07-25 18:10:43 +02:00
Dominik Sliwa
41e283ce0a Add L1/L4 GND pour
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-07-25 10:48:18 +02:00
Dominik Sliwa
f6dc839e95 EMC optimisations
-eth shield is not connected to the GND rather it shields "input" of poe
-used smaller package for bulk PoE capacitor
-Changed common mode filter to Pulse T8113
-Added more inductor filters on the primary side
-replaced secondary side ferrite silter with an inductor
-used distributed "flyback" capacitor (3 instead of 1)
-slightly increased distance between the poe transformer and the
ethernet signal traces
- extended GND1 under the transformer
- primary snubber circuit is now in "hot-loop" area
-repositioned poe enable optocoupler

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-07-25 01:29:09 +02:00
Stefan Agner
b10f30d26b Add proper D30/D31 BOM information
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-06-30 11:51:18 +02:00
Dominik Sliwa
a60829b4cf USB-UART: PCB: Add CP2102n power diode and fix DRC issues
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-06-28 15:01:34 +02:00
Dominik Sliwa
6331577661 PCB: Adjust GND/GND1 planes
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-06-26 14:50:34 +02:00
Dominik Sliwa
96ab6794d5 Use CM4 3.3V as EN fot 3.3Vp
-changed snubber circuit diode to a "normal" from schottky

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-06-16 17:28:26 +02:00
Dominik Sliwa
04eb3ebc7e Adjust PoE and change 3.3V supply topology
-Snubber circuit under ecrtail load condition can dissipate more power
then the resistor can handle, increased the resistor size and added one
more in parallel
-Increased size of some of the 12V input capacitors
-Use 3.3Vp instead of 3.3V generated by the RPi for LED, RTC, Radio, Fan
control and RPi reduced hat connector
-PoE pri/sec capacitor value changed

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-06-16 12:50:43 +02:00
Dominik Sliwa
5688e1d4e1 poe 1.3 improvements for emc includes MPS layout sugestions
decreased coupling between poe lines and  the gnd plane
added vias to stich main gnd planes
decreased the peak current through the transformer
inductor based pi filter on the poe output
decreased coupling to gnd of the poe "noise path"
added parallel mosfet capacitance to poe
moved fb line fo the dcdcs away from inductors

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-06-13 23:20:13 +02:00
Stefan Agner
0b4049bec1 Refill zones as suggested when generating Gerber files
Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.2c
2022-05-31 15:20:03 +02:00
Dominik Sliwa
ecaa06ffad Add assembly option for cp2102n Vbus supply from 3.3V
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-05-31 13:57:36 +02:00
Stefan Agner
fd2eb859d7 Schematic/PCB version v1.2c
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-05-31 13:06:06 +02:00
Dominik Sliwa
b0e748ddb2 workaround for CP2102N backfeeeding from Vio
Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-05-31 01:04:44 +02:00
Stefan Agner
82fab35211 Schematic/PCB version v1.2b
Increment to sub-version v1.2. Main changes are:
- Back and front silk screen
- LED resistors

There are no changes in the layout and any critical components.

Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.2b
2022-04-27 21:48:15 +02:00
Stefan Agner
58237e2c45 Adjust LED resistors for radio and activity LED
Set the blue radio LED to 2.2k and the green activity LED to 22k.

Fixes: #48

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-04-27 21:35:42 +02:00
Stefan Agner
a1c68ebe8e Add CM4 outlines to silkscreen
Also adjust line outline thickness of the CM4 and heatsink.

Fixes #50

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-04-22 16:27:50 +02:00
Stefan Agner
fe877ecc04 Update Home Assistant and Nabu Casa logo
Fixes: #47

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-03-30 18:33:54 +02:00
Stefan Agner
574e6d401b Add UKCA mark to bottom silk screen
Fixes: #46

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-03-30 14:34:42 +02:00
Stefan Agner
e0e2b8ecd0 Bump revision to 1.2
Bump revision to 1.2 in Schematic/PCB sheets and update the date.

Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.2
2022-02-15 22:05:53 +01:00
Stefan Agner
37376dea76 Remove unused DRC exclusions
Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-02-15 21:59:48 +01:00
Stefan Agner
a298a6461d Adjust/fix silkscreen
- Place reference properly
- Move and update Wireless smart-home text
- Move and update PoE+ text
- Readd symbols and back silkscreen (with proper attributes)

Signed-off-by: Stefan Agner <stefan@agner.ch>
2022-02-15 21:40:26 +01:00
Dominik Sliwa
42cd10c86b Moved PoE few mm lower
In order to accomodate the C93 next to the transformer.
Added top layer GND1 pour under the transformer
shortened the GNDS path.

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-02-15 20:59:48 +01:00
Dominik Sliwa
9354729d76 Zone cleanup
Cleanup some fill zones.
Updated the Transformer symbol with pin 4, connected to +48V for better
zone fill.
fixed top/bottom transition for the DC_IN_F
Added some gnd vias

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-02-15 12:02:54 +01:00
Dominik Sliwa
8fd9133aec PoE EMI optimization
Modified PoE layout to account for GNDS-GND1 flow
and repositioned the noise retern capacitor.
Snubber was corrected for the transformer used and the switching
frequency. Some components were removed.
PoE Input filter was adjusted.

3.3 and 5V DCDC capacitor layout was optimised and unused components
were removed.

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-02-15 00:29:21 +01:00
Dominik Sliwa
f5f77585a0 Move J11 5.08mm up
Moved the reduced rPI hat conenctor to accomodate bigger hats

Signed-off-by: Dominik Sliwa <dominik@sliwa.io>
2022-02-05 18:53:46 +01:00
Stefan Agner
8f5fade02a Various minor silk screen/PCB tweaks
- Fix edge cut on lower right corner to make board size exact
- Update board charactristics
- Set grid origin back to 30, 30
- Update M.2 expansion silk screen (remove AI accelerator hint)
- Various silk screen reference designator fixes/improvements
- Add ESD warning logo

Signed-off-by: Stefan Agner <stefan@agner.ch>
v1.1
2022-01-10 11:19:45 +01:00